Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9040237 | Sensor arrays and nucleic acid sequencing applications | Tae-Woong Koo, Selena Chan, Xing Su, Zhang Jingwu, Mineo Yamakawa | 2015-05-26 |
| 7919859 | Copper die bumps with electromigration cap and plated solder | Ting Zhong, Mark Bohr | 2011-04-05 |