Issued Patents All Time
Showing 25 most recent of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201129 | Designs and methods for conductive bumps | Sridhar Balakrishnan, Mark Bohr | 2021-12-14 |
| 10249588 | Designs and methods for conductive bumps | Sridhar Balakrishnan, Mark Bohr | 2019-04-02 |
| 10035147 | Wafer with gel-based biochips for electrochemical synthesis and electrical detection of polymers | Nikolay Suetin | 2018-07-31 |
| 9543261 | Designs and methods for conductive bumps | Sridhar Balakrishnan, Mark Bohr | 2017-01-10 |
| 9508675 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Chuan Hu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran | 2016-11-29 |
| 9391054 | Method of making the light source structure in flexible substrate | — | 2016-07-12 |
| 9105628 | Through substrate via (TSuV) structures and method of making the same | — | 2015-08-11 |
| 9085461 | Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis | Florian Gstrein, Gordon Holt, Brandon Barnett | 2015-07-21 |
| 8940143 | Gel-based bio chip for electrochemical synthesis and electrical detection of polymers | Nikolay Suetin | 2015-01-27 |
| 8933473 | Method, apparatus and system for providing light source structures on a flexible substrate | — | 2015-01-13 |
| 8911609 | Methods for electroplating copper | Xingling Xu, Yingxiang Tao, James D. Blanchard | 2014-12-16 |
| 8580679 | Designs and methods for conductive bumps | Sridhar Balakrishnan, Mark Bohr | 2013-11-12 |
| 8541876 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Chuan Hu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran | 2013-09-24 |
| 8319287 | Tunable gate electrode work function material for transistor applications | Adrien LaVoie, John J. Plombon, Juan E. Dominguez, Harsono S. Simka, Joseph H. Han +1 more | 2012-11-27 |
| 8278121 | Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis | Florian Gstrein, Gordon Holt, Brandon Barnett | 2012-10-02 |
| 8227335 | Forming a copper diffusion barrier | Steven W. Johnston, Michael L. McSwiney, Peter K. Moon | 2012-07-24 |
| 8053774 | Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis | Florian Gstrein, Gordon Holt, Brandon Barnett | 2011-11-08 |
| 7964174 | Nanotube growth and device formation | Juan E. Dominguez, Chin-Chang Cheng | 2011-06-21 |
| 7905994 | Substrate holder and electroplating system | James D. Blanchard | 2011-03-15 |
| 7847394 | Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface | Thomas Dory | 2010-12-07 |
| 7755082 | Forming self-aligned nano-electrodes | Swaminathan Sivakumar, Andrew Berlin, Mark Bohr | 2010-07-13 |
| 7709873 | Polymer memory with adhesion layer containing an immobilized metal | Ebrahim Andideh | 2010-05-04 |
| 7704791 | Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface | Thomas Dory | 2010-04-27 |
| 7682891 | Tunable gate electrode work function material for transistor applications | Adrien LaVoie, John J. Plombon, Juan E. Dominguez, Harsono S. Simka, Joseph H. Han +1 more | 2010-03-23 |
| 7635503 | Composite metal films and carbon nanotube fabrication | Juan E. Dominguez, Florian Gstrein, Michael Goldstein | 2009-12-22 |