| 9508675 |
Microelectronic package having direct contact heat spreader and method of manufacturing same |
Daoqiang Lu, Chuan Hu, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin |
2016-11-29 |
$9,403,000 |
| 9153547 |
Integrated inductor structure and method of fabrication |
Ankur Crawford, Henning Braunisch, Rajendran Nair, Shan X. Wang |
2015-10-06 |
$14,030,000 |
| 8541876 |
Microelectronic package having direct contact heat spreader and method of manufacturing same |
Daoqiang Lu, Chuan Hu, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin |
2013-09-24 |
$22,458,000 |
| 7826694 |
Electrical/optical integration scheme using direct copper bonding |
Jun Zheng |
2010-11-02 |
$10,795,000 |
| 7821073 |
Patterned backside stress engineering for transistor performance optimization |
Rajashree Baskaran |
2010-10-26 |
$15,337,000 |
| 7703991 |
Flip-chip mountable optical connector for chip-to-chip optical interconnectability |
Daoqiang Lu, Henning Braunisch |
2010-04-27 |
$12,857,000 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more |
2009-08-18 |
$24,226,000 |
| 7569426 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Alan M. Myers, R. Scott List |
2009-08-04 |
$15,097,000 |
| 7372120 |
Methods and apparatus to optically couple an optoelectronic chip to a waveguide |
Steven Towle, Henning Braunisch, Daoqiang Lu |
2008-05-13 |
$17,373,000 |
| 7371630 |
Patterned backside stress engineering for transistor performance optimization |
Rajashree Baskaran |
2008-05-13 |
$17,373,000 |
| 7359591 |
Electrical/optical integration scheme using direct copper bonding |
Jun Zheng |
2008-04-15 |
$20,104,000 |
| 7355277 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Alan M. Myers, R. Scott List |
2008-04-08 |
$22,423,000 |
| 7330357 |
Integrated circuit die/package interconnect |
Hamid Azimi |
2008-02-12 |
$36,180,000 |
| 7283699 |
Optical package |
Daoqiang Lu, Henning Braunisch |
2007-10-16 |
$25,589,000 |
| 7236666 |
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device |
Henning Braunisch, Daoqiang Lu, Steven Towle |
2007-06-26 |
$20,503,000 |
| 7195941 |
Optical devices and methods to construct the same |
Daoqiang Lu |
2007-03-27 |
$11,700,000 |
| 7085449 |
Waveguide coupling mechanism |
Henning Braunisch, Daoqiang Lu, Steven Towle |
2006-08-01 |
$14,842,000 |
| 7063268 |
Electro-active fluid cooling system |
Gregory M. Chrysler |
2006-06-20 |
$13,743,000 |
| 7038316 |
Bumpless die and heat spreader lid module bonded to bumped die carrier |
Chuan Hu, Daoqiang Lu, Zhiyong Wang |
2006-05-02 |
$12,289,000 |
| 6992381 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more |
2006-01-31 |
$19,938,000 |
| 6888240 |
High performance, low cost microelectronic circuit package with interposer |
Steven Towle, John Tang |
2005-05-03 |
$20,343,000 |
| 6792179 |
Optical thumbtack |
Daoqiang Lu, Steven Towle, Henning Braunisch |
2004-09-14 |
$15,917,000 |
| 6720814 |
Electronic package with integrated clock distribution structure |
Henning Braunisch, Raj Nair |
2004-04-13 |
$35,249,000 |
| 6717066 |
Electronic packages having multiple-zone interconnects and methods of manufacture |
Yuan-Liang Li |
2004-04-06 |
$23,009,000 |
| 6593793 |
Electronic package with integrated clock distribution structure |
Henning Braunisch, Raj Nair |
2003-07-15 |
$37,859,000 |
