Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508675 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Chuan Hu, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin | 2016-11-29 |
| 9153547 | Integrated inductor structure and method of fabrication | Ankur Crawford, Henning Braunisch, Rajendran Nair, Shan X. Wang | 2015-10-06 |
| 8541876 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Chuan Hu, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin | 2013-09-24 |
| 7826694 | Electrical/optical integration scheme using direct copper bonding | Jun Zheng | 2010-11-02 |
| 7821073 | Patterned backside stress engineering for transistor performance optimization | Rajashree Baskaran | 2010-10-26 |
| 7703991 | Flip-chip mountable optical connector for chip-to-chip optical interconnectability | Daoqiang Lu, Henning Braunisch | 2010-04-27 |
| 7576432 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more | 2009-08-18 |
| 7569426 | Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package | Alan M. Myers, R. Scott List | 2009-08-04 |
| 7372120 | Methods and apparatus to optically couple an optoelectronic chip to a waveguide | Steven Towle, Henning Braunisch, Daoqiang Lu | 2008-05-13 |
| 7371630 | Patterned backside stress engineering for transistor performance optimization | Rajashree Baskaran | 2008-05-13 |
| 7359591 | Electrical/optical integration scheme using direct copper bonding | Jun Zheng | 2008-04-15 |
| 7355277 | Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package | Alan M. Myers, R. Scott List | 2008-04-08 |
| 7330357 | Integrated circuit die/package interconnect | Hamid Azimi | 2008-02-12 |
| 7283699 | Optical package | Daoqiang Lu, Henning Braunisch | 2007-10-16 |
| 7236666 | On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device | Henning Braunisch, Daoqiang Lu, Steven Towle | 2007-06-26 |
| 7195941 | Optical devices and methods to construct the same | Daoqiang Lu | 2007-03-27 |
| 7085449 | Waveguide coupling mechanism | Henning Braunisch, Daoqiang Lu, Steven Towle | 2006-08-01 |
| 7063268 | Electro-active fluid cooling system | Gregory M. Chrysler | 2006-06-20 |
| 7038316 | Bumpless die and heat spreader lid module bonded to bumped die carrier | Chuan Hu, Daoqiang Lu, Zhiyong Wang | 2006-05-02 |
| 6992381 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more | 2006-01-31 |
| 6888240 | High performance, low cost microelectronic circuit package with interposer | Steven Towle, John Tang | 2005-05-03 |
| 6792179 | Optical thumbtack | Daoqiang Lu, Steven Towle, Henning Braunisch | 2004-09-14 |
| 6720814 | Electronic package with integrated clock distribution structure | Henning Braunisch, Raj Nair | 2004-04-13 |
| 6717066 | Electronic packages having multiple-zone interconnects and methods of manufacture | Yuan-Liang Li | 2004-04-06 |
| 6593793 | Electronic package with integrated clock distribution structure | Henning Braunisch, Raj Nair | 2003-07-15 |