Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
JT

John Tang — 12 Patents

Intel: 10 patents #4,072 of 30,777Top 15%
JPMorgan Chase: 2 patents #992 of 3,779Top 30%
New York, NY: #1,598 of 20,192 inventorsTop 8%
New York: #12,442 of 115,490 inventorsTop 15%
Overall (All Time): #396,045 of 4,157,543Top 10%
12 Patents All Time
John Tang has been granted 12 US patents while listed as an inventor at Intel. The first was granted in 2004 and the most recent in September 2021. John Tang ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list John Tang in New York, NY, US.

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11126971 Systems and methods for privacy-preserving enablement of connections within organizations Michael Bennett Solovay, Benjamin F. Sylvester, III, Ashleigh Ann THOMPSON 2021-09-21 $686,514,000
10346915 Systems and methods for hierarchical dual-dynamic exception management Rajesh L. Tolani, Jeremy M. Dobrick, Frank VAN HOOF, Ciaran Kelly, Kirk Trivett +4 more 2019-07-09 $661,303,000
7989916 Integrated capacitors in package-level structures, processes of making same, and systems containing same Xiang Yin Zeng, Jiangqi He, Ding Hai 2011-08-02 $15,238,000
7981726 Copper plating connection for multi-die stack in substrate package Henry Xu, Jianmin Li, Xiang Yin Zeng 2011-07-19 $15,862,000
7714432 Ceramic/organic hybrid substrate 2010-05-11 $17,259,000
7670919 Integrated capacitors in package-level structures, processes of making same, and systems containing same Xiang Yin Zeng, Jiangqi He, Ding Hai 2010-03-02 $14,883,000
7511359 Dual die package with high-speed interconnect Xiang Yin Zeng, Jiangqi He 2009-03-31 $17,039,000
7435664 Wafer-level bonding for mechanically reinforced ultra-thin die Daoqiang Lu 2008-10-14 $13,671,000
7405364 Decoupled signal-power substrate architecture Rajendran Nair 2008-07-29 $26,149,000
7183658 Low cost microelectronic circuit package Steven Towle, John Cuendet, Henning Braunisch, Thomas Dory 2007-02-27 $10,067,000
6888240 High performance, low cost microelectronic circuit package with interposer Steven Towle, Gilroy Vandentop 2005-05-03 $20,343,000
6803649 Electronic assembly Jiangqi He, Jung Kang, Dong Zhong, Yuan-Liang Li 2004-10-12 $44,708,000