| 11126971 |
Systems and methods for privacy-preserving enablement of connections within organizations |
Michael Bennett Solovay, Benjamin F. Sylvester, III, Ashleigh Ann THOMPSON |
2021-09-21 |
| 10346915 |
Systems and methods for hierarchical dual-dynamic exception management |
Rajesh L. Tolani, Jeremy M. Dobrick, Frank VAN HOOF, Ciaran Kelly, Kirk Trivett +4 more |
2019-07-09 |
| 7989916 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same |
Xiang Yin Zeng, Jiangqi He, Ding Hai |
2011-08-02 |
| 7981726 |
Copper plating connection for multi-die stack in substrate package |
Henry Xu, Jianmin Li, Xiang Yin Zeng |
2011-07-19 |
| 7714432 |
Ceramic/organic hybrid substrate |
— |
2010-05-11 |
| 7670919 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same |
Xiang Yin Zeng, Jiangqi He, Ding Hai |
2010-03-02 |
| 7511359 |
Dual die package with high-speed interconnect |
Xiang Yin Zeng, Jiangqi He |
2009-03-31 |
| 7435664 |
Wafer-level bonding for mechanically reinforced ultra-thin die |
Daoqiang Lu |
2008-10-14 |
| 7405364 |
Decoupled signal-power substrate architecture |
Rajendran Nair |
2008-07-29 |
| 7183658 |
Low cost microelectronic circuit package |
Steven Towle, John Cuendet, Henning Braunisch, Thomas Dory |
2007-02-27 |
| 6888240 |
High performance, low cost microelectronic circuit package with interposer |
Steven Towle, Gilroy Vandentop |
2005-05-03 |
| 6803649 |
Electronic assembly |
Jiangqi He, Jung Kang, Dong Zhong, Yuan-Liang Li |
2004-10-12 |
