Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8189361 | Multi-chip assembly with optically coupled die | Qing Zhou, Daoqiang Lu, Jiangqi He, Wei Shi | 2012-05-29 |
| 7989916 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | John Tang, Jiangqi He, Ding Hai | 2011-08-02 |
| 7981726 | Copper plating connection for multi-die stack in substrate package | John Tang, Henry Xu, Jianmin Li | 2011-07-19 |
| 7852189 | Packaged spiral inductor structures, processes of making same, and systems containing same | Jiangqi He, Robert L. Sankman, BaoShu Xu | 2010-12-14 |
| 7851809 | Multi-chip assembly with optically coupled die | Qing Zhou, Daoqiang Lu, Jiangqi He, Wei Shi | 2010-12-14 |
| 7723164 | Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same | Daoqiang Lu, Jiangqi He, Jiamiao Tang | 2010-05-25 |
| 7714430 | Substrate with lossy material insert | Daoqiang Lu, Jiangqi He, Jiamiao(John) Tang | 2010-05-11 |
| 7709934 | Package level noise isolation | Jiangqi He, Guizhen Zheng | 2010-05-04 |
| 7670919 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | John Tang, Jiangqi He, Ding Hai | 2010-03-02 |
| 7659143 | Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same | Jiamiao Tang, Daoqiang Lu, Jiangqi He | 2010-02-09 |
| 7564066 | Multi-chip assembly with optically coupled die | Qing Zhou, Daoqiang Lu, Jiangqi He, Wei Shi | 2009-07-21 |
| 7535080 | Reducing parasitic mutual capacitances | Jiangqi He, BaoShu Xu | 2009-05-19 |
| 7535689 | Reducing input capacitance of high speed integrated circuits | Ming Dong Cui, Gregory V. Christensen, Mostafa Naguib Abdulla, Daoqiang Lu, Jiangqi He +1 more | 2009-05-19 |
| 7511359 | Dual die package with high-speed interconnect | John Tang, Jiangqi He | 2009-03-31 |
| 7477197 | Package level integration of antenna and RF front-end module | Jiangqi He, Guizhen Zheng | 2009-01-13 |
| 7348661 | Array capacitor apparatuses to filter input/output signal | Hyunjun Kim, Ping Sun, Jiangqi He | 2008-03-25 |
| 7255573 | Data signal interconnection with reduced crosstalk | Jiangqi He, BaoShu Xu | 2007-08-14 |
| 7227247 | IC package with signal land pads | Jiangqi He, BaoShu Xu | 2007-06-05 |
| 7123466 | Extended thin film capacitor (TFC) | Jiangqi He, Ping Sun, Hyunjun Kim | 2006-10-17 |
| 7027289 | Extended thin film capacitor (TFC) | Jiangqi He, Ping Sun, Hyunjun Kim | 2006-04-11 |