Wei Shi — 14 Patents at Intel | Patent Leaderboard

Wei Shi has been granted 14 US patents while listed as an inventor at Intel. The first was granted in 2008 and the most recent in April 2018. Wei Shi ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Wei Shi in San Jose, CA, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9933601	Stacked wafer lens and camera	—	2018-04-03	$16,515,000
9602804	Methods of forming integrated package structures with low Z height 3D camera	—	2017-03-21	$8,001,000
8189361	Multi-chip assembly with optically coupled die	Qing Zhou, Daoqiang Lu, Jiangqi He, Xiang Yin Zeng	2012-05-29	$17,150,000
8148805	Forming compliant contact pads for semiconductor packages	Qing Zhou, Daoqiang Lu, Jiangqi He	2012-04-03	$17,954,000
8012808	Integrated micro-channels for 3D through silicon architectures	Daoqiang Lu, Yiqun Bai, Qing Zhou, Jianqqi He	2011-09-06	$20,814,000
7980865	Substrate with raised edge pads	Daoqiang Lu, Qing Zhou, Jiangqi He	2011-07-19	$15,862,000
7939922	Forming compliant contact pads for semiconductor packages	Qing Zhou, Daoqiang Lu, Jiangqi He	2011-05-10	$28,280,000
7851809	Multi-chip assembly with optically coupled die	Qing Zhou, Daoqiang Lu, Jiangqi He, Xiang Yin Zeng	2010-12-14	$13,117,000
7564066	Multi-chip assembly with optically coupled die	Qing Zhou, Daoqiang Lu, Jiangqi He, Xiang Yin Zeng	2009-07-21	$22,981,000
7554203	Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture	Qing Zhou, Daoqiang Lu, Jiangqi He	2009-06-30	$20,585,000
7538019	Forming compliant contact pads for semiconductor packages	Qing Zhou, Daoqiang Lu, Jiangqi He	2009-05-26	$14,272,000
7439617	Capillary underflow integral heat spreader	Carl Deppisch, Tom Fitzgerald, Fay Hua, Mike Gasparek	2008-10-21	$17,085,000
7432592	Integrated micro-channels for 3D through silicon architectures	Daoqiang Lu, Yiqun Bai, Qing Zhou, Jiangqi He	2008-10-07	$21,141,000
7348678	Integrated circuit package to provide high-bandwidth communication among multiple dice	Qing Zhou, Jiangqi He, Daoqiang Lu	2008-03-25	$11,219,000

Wei Shi — 14 Patents

Issued Patents All Time

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