| 9933601 |
Stacked wafer lens and camera |
— |
2018-04-03 |
| 9602804 |
Methods of forming integrated package structures with low Z height 3D camera |
— |
2017-03-21 |
| 8189361 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Daoqiang Lu, Jiangqi He, Xiang Yin Zeng |
2012-05-29 |
| 8148805 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Daoqiang Lu, Jiangqi He |
2012-04-03 |
| 8012808 |
Integrated micro-channels for 3D through silicon architectures |
Daoqiang Lu, Yiqun Bai, Qing Zhou, Jianqqi He |
2011-09-06 |
| 7980865 |
Substrate with raised edge pads |
Daoqiang Lu, Qing Zhou, Jiangqi He |
2011-07-19 |
| 7939922 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Daoqiang Lu, Jiangqi He |
2011-05-10 |
| 7851809 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Daoqiang Lu, Jiangqi He, Xiang Yin Zeng |
2010-12-14 |
| 7564066 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Daoqiang Lu, Jiangqi He, Xiang Yin Zeng |
2009-07-21 |
| 7554203 |
Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture |
Qing Zhou, Daoqiang Lu, Jiangqi He |
2009-06-30 |
| 7538019 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Daoqiang Lu, Jiangqi He |
2009-05-26 |
| 7439617 |
Capillary underflow integral heat spreader |
Carl Deppisch, Tom Fitzgerald, Fay Hua, Mike Gasparek |
2008-10-21 |
| 7432592 |
Integrated micro-channels for 3D through silicon architectures |
Daoqiang Lu, Yiqun Bai, Qing Zhou, Jiangqi He |
2008-10-07 |
| 7348678 |
Integrated circuit package to provide high-bandwidth communication among multiple dice |
Qing Zhou, Jiangqi He, Daoqiang Lu |
2008-03-25 |