Issued Patents All Time
Showing 26–50 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7633080 | Method to assemble structures from nano-materials | — | 2009-12-15 |
| 7629252 | Conformal electroless deposition of barrier layer materials | Kevin P. O'Brien, Chin-Chang Cheng, Ramanan V. Chebiam, Sridhar Balakrishnan | 2009-12-08 |
| 7629268 | Method for an improved air gap interconnect structure | Peter K. Moon | 2009-12-08 |
| 7625817 | Method of fabricating a carbon nanotube interconnect structures | Florian Gstrein, Juan E. Dominguez, Adrien LaVoie | 2009-12-01 |
| 7597763 | Electroless plating systems and methods | Arnel M. Fajardo, Chin-Chang Cheng | 2009-10-06 |
| 7586196 | Apparatus for an improved air gap interconnect structure | Peter K. Moon | 2009-09-08 |
| 7550385 | Amine-free deposition of metal-nitride films | Adrien LaVoie, Juan E. Dominguez, Kevin P. O'Brien, Steven W. Johnston, John D. Peck +2 more | 2009-06-23 |
| 7525196 | Protection of seedlayer for electroplating | Peter K. Moon | 2009-04-28 |
| 7476974 | Method to fabricate interconnect structures | Tatyana N. Andreyushchenko, Kenneth Cadien, Paul B. Fischer | 2009-01-13 |
| 7476967 | Composite carbon nanotube thermal interface device | — | 2009-01-13 |
| 7470620 | Microcircuit fabrication and interconnection | Mark Bohr | 2008-12-30 |
| 7442634 | Method for constructing contact formations | Tzuen-Luh Huang, Ming Fang, Kevin J. Lee, Yuehai Liang, Margherita Chang | 2008-10-28 |
| 7438794 | Method of copper electroplating to improve gapfill | David Jentz, Ramesh Viswanathan, Paul McGregor, Rajiv Rastogi | 2008-10-21 |
| 7416980 | Forming a barrier layer in interconnect joints and structures formed thereby | Ting Zhong, Ming Fang | 2008-08-26 |
| 7372165 | Method for making a semiconductor device having increased conductive material reliability | Ramanan V. Chebiam | 2008-05-13 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution | Daniel J. Zierath, Vinay Chikarmane | 2008-05-13 |
| 7365011 | Catalytic nucleation monolayer for metal seed layers | Adrien LaVoie, Arnel M. Fajardo | 2008-04-29 |
| 7348675 | Microcircuit fabrication and interconnection | Mark Bohr | 2008-03-25 |
| 7338585 | Electroplating chemistries and methods of forming interconnections | Rohan Akolkar | 2008-03-04 |
| 7316061 | Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface | Thomas Dory | 2008-01-08 |
| 7314543 | Tin deposition | Ming Fang, Scott Haight | 2008-01-01 |
| 7312155 | Forming self-aligned nano-electrodes | Swaminathan Sivakumar, Andrew Berlin, Mark Bohr | 2007-12-25 |
| 7304388 | Method and apparatus for an improved air gap interconnect structure | Peter K. Moon | 2007-12-04 |
| 7300860 | Integrated circuit with metal layer having carbon nanotubes and methods of making same | — | 2007-11-27 |
| 7285494 | Multiple stage electroless deposition of a metal layer | Chin-Chang Cheng | 2007-10-23 |