Issued Patents All Time
Showing 76–100 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977224 | Method of electroless introduction of interconnect structures | Christopher D. Thomas, Paul McGregor, Madhav Datta | 2005-12-20 |
| 6958547 | Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs | Chin-Chang Cheng, Makarem A. Hussein, Phi L. Nguyen, Ruth A. Brain | 2005-10-25 |
| 6933171 | Large bumps for optical flip chips | Ming Fang, Daoqiang Lu | 2005-08-23 |
| 6933222 | Microcircuit fabrication and interconnection | Mark Bohr | 2005-08-23 |
| 6933230 | Method for making interconnects and diffusion barriers in integrated circuits | — | 2005-08-23 |
| 6921684 | Method of sorting carbon nanotubes including protecting metallic nanotubes and removing the semiconducting nanotubes | — | 2005-07-26 |
| 6908504 | Electroless plating bath composition and method of using | Ramanan V. Chebiam | 2005-06-21 |
| 6893550 | Electroplating bath composition and method of using | Kimin Hong, Nate Baxter | 2005-05-17 |
| 6843852 | Apparatus and method for electroless spray deposition | Vincent Caillouette, Christopher D. Thomas, Chin-Chang Cheng | 2005-01-18 |
| 6841458 | Dopant interface formation | Jacob M. Faber | 2005-01-11 |
| 6828613 | Dopant interface formation | Jacob M. Faber | 2004-12-07 |
| 6733679 | Method of treating an electroless plating waste | Chin-Chang Cheng, Christopher D. Thomas | 2004-05-11 |
| 6696758 | Interconnect structures and a method of electroless introduction of interconnect structures | Christopher D. Thomas, Paul McGregor, Madhav Datta | 2004-02-24 |
| 6677233 | Material deposition from a liquefied gas solution | — | 2004-01-13 |
| 6645567 | Electroless plating bath composition and method of using | Ramanan V. Chebiam | 2003-11-11 |
| 6518184 | Enhancement of an interconnect | Stephen Chambers, Andrew Ott, Christine Hau-Riege | 2003-02-11 |
| 6491806 | Electroplating bath composition | Kimin Hong, Nate Baxter | 2002-12-10 |
| 6432821 | Method of copper electroplating | Dave W. Jentz, Christopher Collazo-Davila | 2002-08-13 |
| 6362100 | Methods and apparatus for forming a copper interconnect | Takeshi Nogami, Axel Preusse | 2002-03-26 |
| 6359328 | Methods for making interconnects and diffusion barriers in integrated circuits | — | 2002-03-19 |
| 6271591 | Copper-aluminum metallization | Chiu H. Ting | 2001-08-07 |
| 6249055 | Self-encapsulated copper metallization | — | 2001-06-19 |
| 6162726 | Gas shielding during plating | — | 2000-12-19 |
| 6106680 | Apparatus for forming a copper interconnect | Takeshi Nogami, Axel Preusse | 2000-08-22 |
| 6077780 | Method for filling high aspect ratio openings of an integrated circuit to minimize electromigration failure | — | 2000-06-20 |