Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
CT

Chiu H. Ting — 33 Patents

Intel: 12 patents #3,451 of 30,777Top 15%
CRCutek Research: 9 patents #1 of 9Top 15%
AMD: 6 patents #2,048 of 9,280Top 25%
SESematech: 5 patents #5 of 123Top 5%
BLBlue29: 4 patents #3 of 9Top 35%
CFCornell Research Foundation: 4 patents #199 of 1,638Top 15%
Saratoga, CA: #302 of 2,933 inventorsTop 15%
California: #15,252 of 386,348 inventorsTop 4%
Overall (All Time): #105,480 of 4,157,543Top 3%
33 Patents All Time
Chiu H. Ting has been granted 33 US patents while listed as an inventor at Intel. The first was granted in 1987 and the most recent in September 2005. Chiu H. Ting ranks #105,480 of 4,157,543 US inventors in our database (top 2.5%). Patent records list Chiu H. Ting in Saratoga, CA, US.

Patents per Year

Patents granted per year, 1987 to 2005Bar chart with a peak of 6 patents in 1999.peak 61987: 2 patents19871989: 1 patents1992: 1 patents19921993: 1 patents1994: 1 patents19941997: 2 patents1998: 3 patents19981999: 6 patents2000: 5 patents20002001: 4 patents2002: 3 patents20022004: 1 patents2005: 3 patents2005

Issued Patents All Time

Showing 1–25 of 33 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
6939403 Spatially-arranged chemical processing station Igor Ivanov, Jonathan Weiguo Zhang, Arthur Kolics 2005-09-06
6911067 Solution composition and method for electroless deposition of coatings free of alkali metals Artur Kolics, Nicolai Petrov, Igor Ivanov 2005-06-28
6902605 Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper Artur Kolics, Nicolai Petrov, Igor Ivanov 2005-06-07
6794288 Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation Artur Kolics, Nicolai Petrov, Igor Ivanov 2004-09-21
6492722 Metallized interconnection structure Robin Cheung 2002-12-10 $2,246,000
6402592 Electrochemical methods for polishing copper films on semiconductor substrates Mei Zhu, Igor Ivanov 2002-06-11
6365025 Method for depositing and/or removing material on a substrate William H. Holtkamp 2002-04-02
6271591 Copper-aluminum metallization Valery M. Dubin 2001-08-07 $4,984,000
6187152 Multiple station processing chamber and method for depositing and/or removing material on a substrate William H. Holtkamp 2001-02-13
6183611 Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate William H. Holtkamp 2001-02-06
6179982 Introducing and reclaiming liquid in a wafer processing chamber William H. Holtkamp, Richard W. Brodowski, Joseph Wytman 2001-01-30
6153521 Metallized interconnection structure and method of making the same Robin Cheung 2000-11-28 $3,768,000
6077412 Rotating anode for a wafer processing chamber William H. Holtkamp, Wen-Cheng Ko 2000-06-20
6022465 Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer William H. Holtkamp, Wen-Cheng Ko 2000-02-08
6017437 Process chamber and method for depositing and/or removing material on a substrate William H. Holtkamp, Wen-Cheng Ko, Kenneth J. Lowery, Peter Cho 2000-01-25
6017820 Integrated vacuum and plating cluster system William H. Holtkamp 2000-01-25
5997712 Copper replenishment technique for precision copper plating system Peter Cho, Frank Lin, Tanya Andryushchenko 1999-12-07
5972192 Pulse electroplating copper or copper alloys Valery M. Dubin, Robin Cheung 1999-10-26 $1,975,000
5969422 Plated copper interconnect structure Valery M. Dubin 1999-10-19 $1,257,000
5913147 Method for fabricating copper-aluminum metallization Valery M. Dubin 1999-06-15 $3,878,000
5891513 Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications Valery M. Dubin, Yosef Shacham-Diamand, Bin Zhao, Prahalad K. Vasudev 1999-04-06 $71,710,000
5856705 Sealed semiconductor chip and process for fabricating sealed semiconductor chip 1999-01-05 $155,215,000
5830805 Electroless deposition equipment or apparatus and method of performing electroless deposition Yosi Shacham-Diamand, Valery M. Dubin, Bin Zhao, Prahalad K. Vasudev 1998-11-03 $60,287,000
5824599 Protected encapsulation of catalytic layer for electroless copper interconnect Yosef Schacham-Diamand, Valery M. Dubin, Bin Zhao, Prahalad K. Vasudev, Melvin Joseph DeSilva 1998-10-20 $74,450,000
5742094 Sealed semiconductor chip 1998-04-21 $94,071,000