Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6939403 | Spatially-arranged chemical processing station | Igor Ivanov, Jonathan Weiguo Zhang, Arthur Kolics | 2005-09-06 |
| 6911067 | Solution composition and method for electroless deposition of coatings free of alkali metals | Artur Kolics, Nicolai Petrov, Igor Ivanov | 2005-06-28 |
| 6902605 | Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper | Artur Kolics, Nicolai Petrov, Igor Ivanov | 2005-06-07 |
| 6794288 | Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation | Artur Kolics, Nicolai Petrov, Igor Ivanov | 2004-09-21 |
| 6492722 | Metallized interconnection structure | Robin Cheung | 2002-12-10 |
| 6402592 | Electrochemical methods for polishing copper films on semiconductor substrates | Mei Zhu, Igor Ivanov | 2002-06-11 |
| 6365025 | Method for depositing and/or removing material on a substrate | William H. Holtkamp | 2002-04-02 |
| 6271591 | Copper-aluminum metallization | Valery M. Dubin | 2001-08-07 |
| 6187152 | Multiple station processing chamber and method for depositing and/or removing material on a substrate | William H. Holtkamp | 2001-02-13 |
| 6183611 | Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate | William H. Holtkamp | 2001-02-06 |
| 6179982 | Introducing and reclaiming liquid in a wafer processing chamber | William H. Holtkamp, Richard W. Brodowski, Joseph Wytman | 2001-01-30 |
| 6153521 | Metallized interconnection structure and method of making the same | Robin Cheung | 2000-11-28 |
| 6077412 | Rotating anode for a wafer processing chamber | William H. Holtkamp, Wen-Cheng Ko | 2000-06-20 |
| 6022465 | Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer | William H. Holtkamp, Wen-Cheng Ko | 2000-02-08 |
| 6017820 | Integrated vacuum and plating cluster system | William H. Holtkamp | 2000-01-25 |
| 6017437 | Process chamber and method for depositing and/or removing material on a substrate | William H. Holtkamp, Wen-Cheng Ko, Kenneth J. Lowery, Peter Cho | 2000-01-25 |
| 5997712 | Copper replenishment technique for precision copper plating system | Peter Cho, Frank Lin, Tanya Andryushchenko | 1999-12-07 |
| 5972192 | Pulse electroplating copper or copper alloys | Valery M. Dubin, Robin Cheung | 1999-10-26 |
| 5969422 | Plated copper interconnect structure | Valery M. Dubin | 1999-10-19 |
| 5913147 | Method for fabricating copper-aluminum metallization | Valery M. Dubin | 1999-06-15 |
| 5891513 | Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications | Valery M. Dubin, Yosef Shacham-Diamand, Bin Zhao, Prahalad K. Vasudev | 1999-04-06 |
| 5856705 | Sealed semiconductor chip and process for fabricating sealed semiconductor chip | — | 1999-01-05 |
| 5830805 | Electroless deposition equipment or apparatus and method of performing electroless deposition | Yosi Shacham-Diamand, Valery M. Dubin, Bin Zhao, Prahalad K. Vasudev | 1998-11-03 |
| 5824599 | Protected encapsulation of catalytic layer for electroless copper interconnect | Yosef Schacham-Diamand, Valery M. Dubin, Bin Zhao, Prahalad K. Vasudev, Melvin Joseph DeSilva | 1998-10-20 |
| 5742094 | Sealed semiconductor chip | — | 1998-04-21 |