Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5824599 | Protected encapsulation of catalytic layer for electroless copper interconnect | Valery M. Dubin, Chiu H. Ting, Bin Zhao, Prahalad K. Vasudev, Melvin Joseph DeSilva | 1998-10-20 |