Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615491 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Daniel Stritch, Christian Witt +1 more | 2009-11-10 |
| 7611987 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Daniel Stritch, Christian Witt +1 more | 2009-11-03 |
| 7611988 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Daniel Stritch, Christian Witt +1 more | 2009-11-03 |
| 7410899 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Daniel Stritch, Christian Witt +1 more | 2008-08-12 |
| 7332193 | Cobalt and nickel electroless plating in microelectronic devices | Charles Valverde, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Jr., Richard Hurtubise +1 more | 2008-02-19 |
| 6911067 | Solution composition and method for electroless deposition of coatings free of alkali metals | Artur Kolics, Chiu H. Ting, Igor Ivanov | 2005-06-28 |
| 6902605 | Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper | Artur Kolics, Chiu H. Ting, Igor Ivanov | 2005-06-07 |
| 6875691 | Temperature control sequence of electroless plating baths | Nanhai Li, Artur Kolics | 2005-04-05 |
| 6794288 | Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation | Artur Kolics, Chiu H. Ting, Igor Ivanov | 2004-09-21 |