Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5695810 | Use of cobalt tungsten phosphide as a barrier material for copper metallization | Valery M. Dubin, Yosi Schacham-Diamand, Bin Zhao, Prahalad K. Vasudev | 1997-12-09 |
| 5674787 | Selective electroless copper deposited interconnect plugs for ULSI applications | Bin Zhao, Prahalad K. Vasudev, Valery M. Dubin, Yosef Shacham-Diamand | 1997-10-07 |
| 5300461 | Process for fabricating sealed semiconductor chip using silicon nitride passivation film | — | 1994-04-05 |
| 5183795 | Fully planar metalization process | Pei-Lin Pai | 1993-02-02 |
| 5169680 | Electroless deposition for IC fabrication | Milan Paunovic | 1992-12-08 |
| 4885262 | Chemical modification of spin-on glass for improved performance in IC fabrication | Thomas G. Rucker, Zbigniew P. Sobczak | 1989-12-05 |
| 4700454 | Process for forming MOS transistor with buried oxide regions for insulation | William Baerg, Byron B. Siu, J. C. Tzeng | 1987-10-20 |
| 4654958 | Process for forming isolated silicon regions and field-effect devices on a silicon substrate | William Baerg, Terence Tai-Li Hwa | 1987-04-07 |