Issued Patents All Time
Showing 101–114 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6065424 | Electroless deposition of metal films with spray processor | Yosi Shacham-Diamand, Vinh Van Nguyen | 2000-05-23 |
| 6001415 | Via with barrier layer for impeding diffusion of conductive material from via into insulator | Takeshi Nogami | 1999-12-14 |
| 5972192 | Pulse electroplating copper or copper alloys | Chiu H. Ting, Robin Cheung | 1999-10-26 |
| 5969422 | Plated copper interconnect structure | Chiu H. Ting | 1999-10-19 |
| 5968333 | Method of electroplating a copper or copper alloy interconnect | Takeshi Nogami, Robin Cheung | 1999-10-19 |
| 5913147 | Method for fabricating copper-aluminum metallization | Chiu H. Ting | 1999-06-15 |
| 5895562 | Gas shielding during plating | — | 1999-04-20 |
| 5891513 | Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications | Yosef Shacham-Diamand, Chiu H. Ting, Bin Zhao, Prahalad K. Vasudev | 1999-04-06 |
| 5882498 | Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate | Takeshi Nogami | 1999-03-16 |
| 5833820 | Electroplating apparatus | — | 1998-11-10 |
| 5830805 | Electroless deposition equipment or apparatus and method of performing electroless deposition | Yosi Shacham-Diamand, Chiu H. Ting, Bin Zhao, Prahalad K. Vasudev | 1998-11-03 |
| 5824599 | Protected encapsulation of catalytic layer for electroless copper interconnect | Yosef Schacham-Diamand, Chiu H. Ting, Bin Zhao, Prahalad K. Vasudev, Melvin Joseph DeSilva | 1998-10-20 |
| 5695810 | Use of cobalt tungsten phosphide as a barrier material for copper metallization | Yosi Schacham-Diamand, Bin Zhao, Prahalad K. Vasudev, Chiu H. Ting | 1997-12-09 |
| 5674787 | Selective electroless copper deposited interconnect plugs for ULSI applications | Bin Zhao, Prahalad K. Vasudev, Yosef Shacham-Diamand, Chiu H. Ting | 1997-10-07 |