Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955534 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Joseph M. Steigerwald, Jinhong SHIN, Christopher P. Auth | 2024-04-09 |
| 11581419 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Joseph M. Steigerwald, Jinhong SHIN, Christopher P. Auth | 2023-02-14 |
| 10854731 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Joseph M. Steigerwald, Jinhong SHIN, Christopher P. Auth | 2020-12-01 |
| 10777655 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Joseph M. Steigerwald, Jinhong SHIN, Christopher P. Auth | 2020-09-15 |
| 8278718 | Stressed barrier plug slot contact structure for transistor performance enhancement | Kevin J. Fischer, Brennan Peterson | 2012-10-02 |
| 8120119 | Stressed barrier plug slot contact structure for transistor performance enhancement | Kevin J. Fischer, Brennan Peterson | 2012-02-21 |
| 7968952 | Stressed barrier plug slot contact structure for transistor performance enhancement | Kevin J. Fischer, Brennan Peterson | 2011-06-28 |
| 7768126 | Barrier formation and structure to use in semiconductor devices | Kevin J. Fischer, Brennan Peterson | 2010-08-03 |
| 7741219 | Method for manufacturing a semiconductor device using the self aligned contact (SAC) process flow for semiconductor devices with aluminum metal gates | Yang Cao | 2010-06-22 |
| 7719062 | Tuned tensile stress low resistivity slot contact structure for n-type transistor performance enhancement | Kevin J. Fischer, Brennan Peterson | 2010-05-18 |
| 7582558 | Reducing corrosion in copper damascene processes | Kevin J. Fischer, Brennan Peterson | 2009-09-01 |
| 7525197 | Barrier process/structure for transistor trench contact applications | Kevin J. Fischer, Brennan Peterson | 2009-04-28 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution | Daniel J. Zierath, Valery M. Dubin | 2008-05-13 |
| 7070687 | Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing | Chi-Hwa Tsang | 2006-07-04 |
| 7001641 | Seed layer treatment | Valery M. Dubin, Christopher D. Thomas | 2006-02-21 |
| 5804251 | Low temperature aluminum alloy plug technology | Jick Yu | 1998-09-08 |