Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315735 | Methods for removing etch stop layers | Suketu Arun Parikh, Tom Choi, Joung Joo Lee, Nitin K. Ingle | 2025-05-27 |
| 12199168 | Plugs for interconnect lines for advanced integrated circuit structure fabrication | Ilsup JIN, Angelo Kandas, Michael L. Hattendorf, Christopher P. Auth | 2025-01-14 |
| 12142667 | Contact over active gate structures for advanced integrated circuit structure fabrication | Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf, Christopher P. Auth | 2024-11-12 |
| 12067338 | Multi version library cell handling and integrated circuit structures fabricated therefrom | Ranjith Kumar, Quan Shi, Mark Bohr, Sourav Chakravarty, Barbara A. Chappell +1 more | 2024-08-20 |
| 11955534 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth | 2024-04-09 |
| 11581419 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth | 2023-02-14 |
| 11404559 | Plugs for interconnect lines for advanced integrated circuit structure fabrication | Ilsup JIN, Angelo Kandas, Michael L. Hattendorf, Christopher P. Auth | 2022-08-02 |
| 11271010 | Multi version library cell handling and integrated circuit structures fabricated therefrom | Ranjith Kumar, Quan Shi, Mark Bohr, Sourav Chakravarty, Barbara A. Chappell +1 more | 2022-03-08 |
| 11031487 | Contact over active gate structures for advanced integrated circuit structure fabrication | Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf, Christopher P. Auth | 2021-06-08 |
| 10943817 | Etch-stop layer topography for advanced integrated circuit structure fabrication | Ruth A. Brain, Michael L. Hattendorf, Christopher P. Auth | 2021-03-09 |
| 10854731 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth | 2020-12-01 |
| 10818774 | Plugs for interconnect lines for advanced integrated circuit structure fabrication | Ilsup JIN, Angelo Kandas, Michael L. Hattendorf, Christopher P. Auth | 2020-10-27 |
| 10796951 | Etch-stop layer topography for advanced integrated circuit structure fabrication | Ruth A. Brain, Michael L. Hattendorf, Christopher P. Auth | 2020-10-06 |
| 10777655 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth | 2020-09-15 |
| 10541316 | Contact over active gate structures for advanced integrated circuit structure fabrication | Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf, Christopher P. Auth | 2020-01-21 |
| 10229879 | Thickened stress relief and power distribution layer | Kevin J. Fischer, Christopher M. Pelto | 2019-03-12 |
| 9818710 | Anchored interconnect | Jiho Kang, Hiten Kothari, Carole C. Montarou | 2017-11-14 |
| 9679845 | Necked interconnect fuse structure for integrated circuits | Zhanping Chen, Seongtae Jeong, Uddalak Bhattacharya, Charles H. Wallace | 2017-06-13 |
| 9530740 | 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach | Kevin J. Lee, Mark Bohr, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more | 2016-12-27 |
| 9496173 | Thickened stress relief and power distribution layer | Kevin J. Fischer, Christopher M. Pelto | 2016-11-15 |
| 9449913 | 3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias | Kevin J. Lee, Mark Bohr, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more | 2016-09-20 |
| 9391013 | 3D integrated circuit package with window interposer | Debendra Mallik, Ram Viswanath, Sriram Srinivasan, Mark Bohr, Sairam Agraharam | 2016-07-12 |
| 9142510 | 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach | Kevin J. Lee, Mark Bohr, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more | 2015-09-22 |
| 9129958 | 3D integrated circuit package with window interposer | Debendra Mallik, Ram Viswanath, Sriram Srinivasan, Mark Bohr, Sairam Agraharam | 2015-09-08 |
| 8827550 | Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer | Mohamed A. Abdelmoneum, Tawfik M. Rahal-Arabi, Gregory F. Taylor, Kevin J. Fischer | 2014-09-09 |