| 12495582 |
Self-aligned wide backside power rail contacts to multiple transistor sources |
Suketu Arun Parikh, Ashish Pal, El Mehdi Bazizi, Nitin K. Ingle, Arvind Sundarrajan +5 more |
2025-12-09 |
|
| 12315735 |
Methods for removing etch stop layers |
Suketu Arun Parikh, Tom Choi, Joung Joo Lee, Nitin K. Ingle |
2025-05-27 |
|
| 12199168 |
Plugs for interconnect lines for advanced integrated circuit structure fabrication |
Ilsup JIN, Angelo Kandas, Michael L. Hattendorf, Christopher P. Auth |
2025-01-14 |
|
| 12142667 |
Contact over active gate structures for advanced integrated circuit structure fabrication |
Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf, Christopher P. Auth |
2024-11-12 |
$28,491,000 |
| 12067338 |
Multi version library cell handling and integrated circuit structures fabricated therefrom |
Ranjith Kumar, Quan Shi, Mark Bohr, Sourav Chakravarty, Barbara A. Chappell +1 more |
2024-08-20 |
$20,163,000 |
| 11955534 |
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication |
Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth |
2024-04-09 |
$27,197,000 |
| 11581419 |
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication |
Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth |
2023-02-14 |
$12,790,000 |
| 11404559 |
Plugs for interconnect lines for advanced integrated circuit structure fabrication |
Ilsup JIN, Angelo Kandas, Michael L. Hattendorf, Christopher P. Auth |
2022-08-02 |
$13,520,000 |
| 11271010 |
Multi version library cell handling and integrated circuit structures fabricated therefrom |
Ranjith Kumar, Quan Shi, Mark Bohr, Sourav Chakravarty, Barbara A. Chappell +1 more |
2022-03-08 |
$16,017,000 |
| 11031487 |
Contact over active gate structures for advanced integrated circuit structure fabrication |
Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf, Christopher P. Auth |
2021-06-08 |
$26,946,000 |
| 10943817 |
Etch-stop layer topography for advanced integrated circuit structure fabrication |
Ruth A. Brain, Michael L. Hattendorf, Christopher P. Auth |
2021-03-09 |
$45,039,000 |
| 10854731 |
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication |
Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth |
2020-12-01 |
$25,476,000 |
| 10818774 |
Plugs for interconnect lines for advanced integrated circuit structure fabrication |
Ilsup JIN, Angelo Kandas, Michael L. Hattendorf, Christopher P. Auth |
2020-10-27 |
$34,955,000 |
| 10796951 |
Etch-stop layer topography for advanced integrated circuit structure fabrication |
Ruth A. Brain, Michael L. Hattendorf, Christopher P. Auth |
2020-10-06 |
$29,609,000 |
| 10777655 |
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication |
Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth |
2020-09-15 |
$34,212,000 |
| 10541316 |
Contact over active gate structures for advanced integrated circuit structure fabrication |
Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf, Christopher P. Auth |
2020-01-21 |
$31,546,000 |
| 10229879 |
Thickened stress relief and power distribution layer |
Kevin J. Fischer, Christopher M. Pelto |
2019-03-12 |
$21,255,000 |
| 9818710 |
Anchored interconnect |
Jiho Kang, Hiten Kothari, Carole C. Montarou |
2017-11-14 |
$11,178,000 |
| 9679845 |
Necked interconnect fuse structure for integrated circuits |
Zhanping Chen, Seongtae Jeong, Uddalak Bhattacharya, Charles H. Wallace |
2017-06-13 |
$8,497,000 |
| 9530740 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach |
Kevin J. Lee, Mark Bohr, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-12-27 |
$11,980,000 |
| 9496173 |
Thickened stress relief and power distribution layer |
Kevin J. Fischer, Christopher M. Pelto |
2016-11-15 |
$10,003,000 |
| 9449913 |
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias |
Kevin J. Lee, Mark Bohr, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-09-20 |
$10,814,000 |
| 9391013 |
3D integrated circuit package with window interposer |
Debendra Mallik, Ram Viswanath, Sriram Srinivasan, Mark Bohr, Sairam Agraharam |
2016-07-12 |
$10,128,000 |
| 9142510 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach |
Kevin J. Lee, Mark Bohr, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more |
2015-09-22 |
$9,820,000 |
| 9129958 |
3D integrated circuit package with window interposer |
Debendra Mallik, Ram Viswanath, Sriram Srinivasan, Mark Bohr, Sairam Agraharam |
2015-09-08 |
$18,285,000 |
