| 12500207 |
Packaging architecture with intermediate routing layers |
Kimin Jun, Adel A. Elsherbini, Georgios Dogiamis, Bradley A. Jackson, Shawna M. Liff +1 more |
2025-12-16 |
|
| 12469801 |
Moisture seal coating of hybrid bonded stacked die package assembly |
Debendra Mallik, Mohammad Enamul Kabir, Nitin A. Deshpande, Omkar G. Karhade, Arnab Sarkar +3 more |
2025-11-11 |
|
| 12436467 |
Simulating die rotation to minimize area overhead of reticle stitching for stacked dies |
Scott E. Siers, Satish K. Damaraju |
2025-10-07 |
|
| 12438102 |
Hermetic barrier surrounding a plurality of dies |
Mohammad Enamul Kabir, Keith E. Zawadzki, Shakul Tandon, John K. Taylor, Babita Dhayal |
2025-10-07 |
|
| 12431441 |
Interlayer dielectric stack optimization for wafer bow reduction |
Gwang-Soo Kim, Dimitrios Antartis, Han-Ju Lee |
2025-09-30 |
|
| 12432897 |
Cooling approaches for stitched dies |
Abhishek A. Sharma, Wilfred Gomes, Mark C. Phillips, Swaminathan Sivakumar |
2025-09-30 |
|
| 12345116 |
Expandable metal as backup for elastomeric elements |
Michael Linley Fripp, Stephen Michael Greci |
2025-07-01 |
|
| 12107040 |
Metal insulator metal (MIM) capacitor |
Aaron J. WELSH, David J. TOWNER, Mark A. BLOUNT, Takayoshi ITO, Dragos Seghete +6 more |
2024-10-01 |
$20,560,000 |
| 11634964 |
Swellable rubber element that also creates a cup packer |
Michael Linley Fripp, Stephen Michael Greci, Matthew Arran Willoughby |
2023-04-25 |
$22,848,000 |
| 11598472 |
Clamp on seal for water leaks |
Shanu Thottungal Eldho |
2023-03-07 |
$19,268,000 |
| 11598168 |
Two part bonded seal for static downhole tool applications |
Pompilio Coto |
2023-03-07 |
$19,268,000 |
| 11560768 |
Washout prevention element for expandable metal sealing elements |
Michael Linley Fripp, Stephen Michael Greci, Abdel Hamid Rawhi Abeidoh |
2023-01-24 |
$29,423,000 |
| 11459847 |
Variable density element retainer for use downhole |
— |
2022-10-04 |
$18,471,000 |
| 11421505 |
Wellbore packer with expandable metal elements |
Michael Linley Fripp, Geir Gjelstad |
2022-08-23 |
$20,435,000 |
| 11261693 |
Composite expandable metal elements with reinforcement |
Stephen Michael Greci |
2022-03-01 |
$15,607,000 |
| 11222863 |
Techniques for die stacking and associated configurations |
Fay Hua, Valluri Rao, Mark Bohr, Johanna M. Swan |
2022-01-11 |
$33,310,000 |
| 10961804 |
Washout prevention element for expandable metal sealing elements |
Michael Linley Fripp, Stephen Michael Greci, Abdel Hamid Rawhi Abeidoh |
2021-03-30 |
$8,698,000 |
| 10229879 |
Thickened stress relief and power distribution layer |
Kevin J. Fischer, Andrew W. Yeoh |
2019-03-12 |
$21,255,000 |
| 9920584 |
Collet lock assembly and method for downhole load diversion |
Jeremy Lynn Stanley |
2018-03-20 |
$15,543,000 |
| 9850121 |
Backside bulk silicon MEMS |
Rajashree Baskaran |
2017-12-26 |
$14,594,000 |
| 9530740 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach |
Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-12-27 |
$11,980,000 |
| 9496173 |
Thickened stress relief and power distribution layer |
Kevin J. Fischer, Andrew W. Yeoh |
2016-11-15 |
$10,003,000 |
| 9449913 |
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias |
Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-09-20 |
$10,814,000 |
| 9196752 |
Backside bulk silicon MEMS |
Rajashree Baskaran |
2015-11-24 |
$18,043,000 |
| 9142510 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach |
Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Hiten Kothari, Seshu V. Sattiraju +1 more |
2015-09-22 |
$9,820,000 |
