Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431441 | Interlayer dielectric stack optimization for wafer bow reduction | Gwang-Soo Kim, Dimitrios Antartis, Han-Ju Lee | 2025-09-30 |
| 12432897 | Cooling approaches for stitched dies | Abhishek A. Sharma, Wilfred Gomes, Mark C. Phillips, Swaminathan Sivakumar | 2025-09-30 |
| 12345116 | Expandable metal as backup for elastomeric elements | Michael Linley Fripp, Stephen Michael Greci | 2025-07-01 |
| 12107040 | Metal insulator metal (MIM) capacitor | Aaron J. WELSH, David J. TOWNER, Mark A. BLOUNT, Takayoshi ITO, Dragos Seghete +6 more | 2024-10-01 |
| 11634964 | Swellable rubber element that also creates a cup packer | Michael Linley Fripp, Stephen Michael Greci, Matthew Arran Willoughby | 2023-04-25 |
| 11598168 | Two part bonded seal for static downhole tool applications | Pompilio Coto | 2023-03-07 |
| 11598472 | Clamp on seal for water leaks | Shanu Thottungal Eldho | 2023-03-07 |
| 11560768 | Washout prevention element for expandable metal sealing elements | Michael Linley Fripp, Stephen Michael Greci, Abdel Hamid Rawhi Abeidoh | 2023-01-24 |
| 11459847 | Variable density element retainer for use downhole | — | 2022-10-04 |
| 11421505 | Wellbore packer with expandable metal elements | Michael Linley Fripp, Geir Gjelstad | 2022-08-23 |
| 11261693 | Composite expandable metal elements with reinforcement | Stephen Michael Greci | 2022-03-01 |
| 11222863 | Techniques for die stacking and associated configurations | Fay Hua, Valluri Rao, Mark Bohr, Johanna M. Swan | 2022-01-11 |
| 10961804 | Washout prevention element for expandable metal sealing elements | Michael Linley Fripp, Stephen Michael Greci, Abdel Hamid Rawhi Abeidoh | 2021-03-30 |
| 10229879 | Thickened stress relief and power distribution layer | Kevin J. Fischer, Andrew W. Yeoh | 2019-03-12 |
| 9920584 | Collet lock assembly and method for downhole load diversion | Jeremy Lynn Stanley | 2018-03-20 |
| 9850121 | Backside bulk silicon MEMS | Rajashree Baskaran | 2017-12-26 |
| 9530740 | 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach | Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Hiten Kothari, Seshu V. Sattiraju +1 more | 2016-12-27 |
| 9496173 | Thickened stress relief and power distribution layer | Kevin J. Fischer, Andrew W. Yeoh | 2016-11-15 |
| 9449913 | 3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias | Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Hiten Kothari, Seshu V. Sattiraju +1 more | 2016-09-20 |
| 9196752 | Backside bulk silicon MEMS | Rajashree Baskaran | 2015-11-24 |
| 9142510 | 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach | Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Hiten Kothari, Seshu V. Sattiraju +1 more | 2015-09-22 |
| 8933564 | Landing structure for through-silicon via | Ruth A. Brain, Kevin J. Lee, Gerald S. Leatherman | 2015-01-13 |