Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7285496 | Hardening of copper to improve copper CMP performance | — | 2007-10-23 |
| 7145244 | Hardening of copper to improve copper CMP performance | — | 2006-12-05 |
| 7064446 | Under bump metallization layer to enable use of high tin content solder bumps | John Barnak, Gerald Feldewerth, Ming Fang, Kevin J. Lee, Tzuen-Luh Huang +3 more | 2006-06-20 |
| 6979646 | Hardening of copper to improve copper CMP performance | — | 2005-12-27 |
| 6909192 | Hardening of copper to improve copper CMP performance | — | 2005-06-21 |