Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12386261 | In-resist process for high density contact formation | Phillip D. Hustad | 2025-08-12 |
| 12169366 | Voltage contrast metrology mark | Cyrus E. Tabery, Simon Hendrik Celine Van Gorp, Simon Philip Spencer Hastings | 2024-12-17 |
| 12112260 | Metrology apparatus and method for determining a characteristic of one or more structures on a substrate | Lorenzo Tripodi, Patrick Warnaar, Grzegorz Grzela, Mohammadreza Hajiahmadi, Farzad Farhadzadeh +5 more | 2024-10-08 |
| 11822255 | Process window based on defect probability | Abraham SLACHTER, Stefan Hunsche, Wim Tjibbo Tel, Anton Bernhard Van Oosten, Koenraad VAN INGEN SCHENAU +1 more | 2023-11-21 |
| 11815349 | Methods and systems for inspecting integrated circuits based on X-rays | Hak Chuah Sim, Andrew George Reid, Nabil Farah Dawahre Olivieri | 2023-11-14 |
| 11187994 | Method for controlling a manufacturing process and associated apparatuses | Mohammad Reza KAMALI | 2021-11-30 |
| 11087065 | Method of manufacturing devices | Sunit S. Mahajan, Abraham SLACHTER, Koen Wilhelmus Cornelis Adrianus Van Der Straten, Antonio CORRADI, Pieter J. Woltgens | 2021-08-10 |
| 11079687 | Process window based on defect probability | Abraham SLACHTER, Stefan Hunsche, Wim Tjibbo Tel, Anton Bernhard Van Oosten, Koenraad VAN INGEN SCHENAU +1 more | 2021-08-03 |
| 10948837 | Information determining apparatus and method | An Lin Gao, Sanjaysingh Lalbahadoersing, Andrey Nikipelov, Alexey Olegovich POLYAKOV | 2021-03-16 |
| 10883924 | Metallic gratings and measurement methods thereof | Sam O' Mullane, Alain C. Diebold, Nicholas James Keller | 2021-01-05 |
| 10283317 | High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella | Paul Keady, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood +2 more | 2019-05-07 |
| 10254110 | Via characterization for BCD and depth metrology | Ke Xiao, Timothy A. Johnson | 2019-04-09 |
| 9653260 | High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella | Paul Keady, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood +2 more | 2017-05-16 |
| 9184025 | Measurement and endpointing of sample thickness | Richard Young, Rudolf Johannes Peter Gerardus Schampers, Michael Moriarty | 2015-11-10 |
| 8278718 | Stressed barrier plug slot contact structure for transistor performance enhancement | Kevin J. Fischer, Vinay Chikarmane | 2012-10-02 |
| 8170832 | Measurement and endpointing of sample thickness | Richard Young, Rudolf Johannes Peter Gerardus Schampers, Michael Moriarty | 2012-05-01 |
| 8120119 | Stressed barrier plug slot contact structure for transistor performance enhancement | Kevin J. Fischer, Vinay Chikarmane | 2012-02-21 |
| 7968952 | Stressed barrier plug slot contact structure for transistor performance enhancement | Kevin J. Fischer, Vinay Chikarmane | 2011-06-28 |
| 7768126 | Barrier formation and structure to use in semiconductor devices | Kevin J. Fischer, Vinay Chikarmane | 2010-08-03 |
| 7719062 | Tuned tensile stress low resistivity slot contact structure for n-type transistor performance enhancement | Kevin J. Fischer, Vinay Chikarmane | 2010-05-18 |
| 7605469 | Atomic layer deposited tantalum containing adhesion layer | Steven W. Johnston, Kerry Spurgin | 2009-10-20 |
| 7601637 | Atomic layer deposited tantalum containing adhesion layer | Steven W. Johnston, Kerry Spurgin | 2009-10-13 |
| 7582558 | Reducing corrosion in copper damascene processes | Vinay Chikarmane, Kevin J. Fischer | 2009-09-01 |
| 7525197 | Barrier process/structure for transistor trench contact applications | Vinay Chikarmane, Kevin J. Fischer | 2009-04-28 |