| 12386261 |
In-resist process for high density contact formation |
Phillip D. Hustad |
2025-08-12 |
| 12169366 |
Voltage contrast metrology mark |
Cyrus E. Tabery, Simon Hendrik Celine Van Gorp, Simon Philip Spencer Hastings |
2024-12-17 |
| 12112260 |
Metrology apparatus and method for determining a characteristic of one or more structures on a substrate |
Lorenzo Tripodi, Patrick Warnaar, Grzegorz Grzela, Mohammadreza Hajiahmadi, Farzad Farhadzadeh +5 more |
2024-10-08 |
| 11822255 |
Process window based on defect probability |
Abraham SLACHTER, Stefan Hunsche, Wim Tjibbo Tel, Anton Bernhard Van Oosten, Koenraad VAN INGEN SCHENAU +1 more |
2023-11-21 |
| 11815349 |
Methods and systems for inspecting integrated circuits based on X-rays |
Hak Chuah Sim, Andrew George Reid, Nabil Farah Dawahre Olivieri |
2023-11-14 |
| 11187994 |
Method for controlling a manufacturing process and associated apparatuses |
Mohammad Reza KAMALI |
2021-11-30 |
| 11087065 |
Method of manufacturing devices |
Sunit S. Mahajan, Abraham SLACHTER, Koen Wilhelmus Cornelis Adrianus Van Der Straten, Antonio CORRADI, Pieter J. Woltgens |
2021-08-10 |
| 11079687 |
Process window based on defect probability |
Abraham SLACHTER, Stefan Hunsche, Wim Tjibbo Tel, Anton Bernhard Van Oosten, Koenraad VAN INGEN SCHENAU +1 more |
2021-08-03 |
| 10948837 |
Information determining apparatus and method |
An Lin Gao, Sanjaysingh Lalbahadoersing, Andrey Nikipelov, Alexey Olegovich POLYAKOV |
2021-03-16 |
| 10883924 |
Metallic gratings and measurement methods thereof |
Sam O' Mullane, Alain C. Diebold, Nicholas James Keller |
2021-01-05 |
| 10283317 |
High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella |
Paul Keady, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood +2 more |
2019-05-07 |
| 10254110 |
Via characterization for BCD and depth metrology |
Ke Xiao, Timothy A. Johnson |
2019-04-09 |
| 9653260 |
High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella |
Paul Keady, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood +2 more |
2017-05-16 |
| 9184025 |
Measurement and endpointing of sample thickness |
Richard Young, Rudolf Johannes Peter Gerardus Schampers, Michael Moriarty |
2015-11-10 |
| 8278718 |
Stressed barrier plug slot contact structure for transistor performance enhancement |
Kevin J. Fischer, Vinay Chikarmane |
2012-10-02 |
| 8170832 |
Measurement and endpointing of sample thickness |
Richard Young, Rudolf Johannes Peter Gerardus Schampers, Michael Moriarty |
2012-05-01 |
| 8120119 |
Stressed barrier plug slot contact structure for transistor performance enhancement |
Kevin J. Fischer, Vinay Chikarmane |
2012-02-21 |
| 7968952 |
Stressed barrier plug slot contact structure for transistor performance enhancement |
Kevin J. Fischer, Vinay Chikarmane |
2011-06-28 |
| 7768126 |
Barrier formation and structure to use in semiconductor devices |
Kevin J. Fischer, Vinay Chikarmane |
2010-08-03 |
| 7719062 |
Tuned tensile stress low resistivity slot contact structure for n-type transistor performance enhancement |
Kevin J. Fischer, Vinay Chikarmane |
2010-05-18 |
| 7605469 |
Atomic layer deposited tantalum containing adhesion layer |
Steven W. Johnston, Kerry Spurgin |
2009-10-20 |
| 7601637 |
Atomic layer deposited tantalum containing adhesion layer |
Steven W. Johnston, Kerry Spurgin |
2009-10-13 |
| 7582558 |
Reducing corrosion in copper damascene processes |
Vinay Chikarmane, Kevin J. Fischer |
2009-09-01 |
| 7525197 |
Barrier process/structure for transistor trench contact applications |
Vinay Chikarmane, Kevin J. Fischer |
2009-04-28 |