Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985328 | Using cell voltage as a monitor for deposition coverage | Yang Cao, Yue Ma, Jir-shyr Chen | 2011-07-26 |
| 7438794 | Method of copper electroplating to improve gapfill | David Jentz, Ramesh Viswanathan, Paul McGregor, Valery M. Dubin | 2008-10-21 |
| 7371312 | Using cell voltage as a monitor for deposition coverage | Yang Cao, Yue Ma, Jir-shyr Chen | 2008-05-13 |
| 5747879 | Interface between titanium and aluminum-alloy in metal stack for integrated circuit | Sandra Underwood, Harry Fujimoto | 1998-05-05 |
| 5286678 | Single step salicidation process | — | 1994-02-15 |