| 12512396 |
Flexible die to floor planning with bump pitch scale through glass core via pitch |
Andrew Collins, Srinivas V. Pietambaram, Tarek A. Ibrahim, Telesphor Kamgaing |
2025-12-30 |
|
| 12494443 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee, Andrew J. Brown |
2025-12-09 |
|
| 12489032 |
Cooling of conformal power delivery structures |
Feras Eid, Henning Braunisch, Adel A. Elsherbini, Thomas L. Sounart, Johanna M. Swan |
2025-12-02 |
|
| 12476175 |
Glass substrates having transverse capacitors for use with semiconductor packages and related methods |
Benjamin Duong, Srinivas V. Pietambaram, Helme Castro De La Torre, Kristof Darmawikarta, Darko Grujicic +5 more |
2025-11-18 |
|
| 12456705 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xia Guo, Steve Cho, Leonel Arana, Robert A. May +1 more |
2025-10-28 |
|
| 12456702 |
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets |
Kimin Jun, Feras Eid, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan +1 more |
2025-10-28 |
|
| 12444619 |
Physical vapor deposition seeding for high aspect ratio vias in glass core technology |
Veronica Strong, Georgios Dogiamis, Telesphor Kamgaing, Neelam Prabhu Gaunkar |
2025-10-14 |
|
| 12444672 |
Hybrid bonding technologies with thermal expansion compensation structures |
Jeremy Ecton, Hisato Tanaka, Brandon C. Marin, Srinivas V. Pietambaram, Xavier Francois Brun |
2025-10-14 |
|
| 12438087 |
High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries |
Adel A. Elsherbini, Feras Eid, Weiyi Li, Stephen L. Morein, Yoshihiro Tomita |
2025-10-07 |
|
| 12431430 |
Technologies for high throughput additive manufacturing for integrated circuit components |
Yoshihiro Tomita, Feras Eid, Adel A. Elsherbini, Wenhao Li, Stephen L. Morein |
2025-09-30 |
|
| 12424719 |
Compact surface transmission line waveguides with vertical ground planes |
Telesphor Kamgaing, Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong |
2025-09-23 |
|
| 12424716 |
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology |
Neelam Prabhu Gaunkar, Veronica Strong, Georgios Dogiamis, Telesphor Kamgaing |
2025-09-23 |
|
| 12381182 |
Direct bonding in microelectronic assemblies |
Feras Eid, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan |
2025-08-05 |
|
| 12368091 |
Package substrate with glass core having vertical power planes for improved power delivery |
Telesphor Kamgaing, Veronica Strong, Georgios Dogiamis, Neelam Prabhu Gaunkar |
2025-07-22 |
|
| 12354992 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xiaoying Guo, Steve Cho, Leonel Arana, Robert Alan May +1 more |
2025-07-08 |
|
| 12349282 |
Capacitors in through glass vias |
Benjamin Duong, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Darko Grujicic, Sashi S. Kandanur +5 more |
2025-07-01 |
|
| 12347761 |
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Veronica Strong, Johanna M. Swan |
2025-07-01 |
|
| 12327775 |
Thermal performance in hybrid bonded 3D die stacks |
Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Julien Sebot |
2025-06-10 |
|
| 12288751 |
Microelectronic assemblies |
Johanna M. Swan |
2025-04-29 |
|
| 12266682 |
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies |
Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more |
2025-04-01 |
|
| 12261097 |
Thermal management in integrated circuit packages |
Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan |
2025-03-25 |
|
| 12255225 |
Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes |
Thomas L. Sounart, Kaan Oguz, Neelam Prabhu Gaunkar, Henning Braunisch, I-Cheng Tung |
2025-03-18 |
|
| 12255130 |
Airgap structures for high speed signal integrity |
Hongxia Feng, Jeremy Ecton, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more |
2025-03-18 |
|
| 12242290 |
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures |
Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more |
2025-03-04 |
|
| 12218069 |
Multi-chip package with high density interconnects |
Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati |
2025-02-04 |
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