Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more | 2025-07-08 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Steve Cho, Jung Kyu Han, Changhua Liu +4 more | 2025-06-24 |
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Kyle McElhinny, Onur Ozkan, Ali Lehaf, Steve Cho, Leonel Arana +4 more | 2025-06-17 |
| 12308329 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli | 2025-05-20 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Brandon C. Marin +4 more | 2025-03-18 |
| 12209711 | Flammable and explosive liquid transportation system and method and application thereof | Bo Li, Sichuan LIU, Wenjun Liu, Changbin WANG, Hongbo Tan +1 more | 2025-01-28 |
| 12142567 | Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density | Xiao Di SUN ZHOU, Debendra Mallik | 2024-11-12 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli | 2024-05-21 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli | 2024-04-30 |
| 11955448 | Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches | Jung Kyu Han, Hongxia Feng, Rahul N. Manepalli | 2024-04-09 |
| 11948898 | Etch barrier for microelectronic packaging conductive structures | Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Benjamin Duong | 2024-04-02 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh +1 more | 2024-03-26 |
| 11881182 | Light-emitting device driver chip, backlight module, and display panel | — | 2024-01-23 |
| 11769735 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli | 2023-09-26 |
| 11763760 | Backlight module and display device | Junyao Fan | 2023-09-19 |
| 11483421 | Terminal device | Linchuan Wang | 2022-10-25 |
| 11404389 | In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages | Jeremy Ecton, Suddhasattwa Nad, Kristof Darmawikarta, Yonggang Li | 2022-08-02 |
| 11088103 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more | 2021-08-10 |