| 12354992 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more |
2025-07-08 |
|
| 12354883 |
Omni directional interconnect with magnetic fillers in mold matrix |
Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more |
2025-07-08 |
|
| 12341117 |
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates |
Kyle McElhinny, Hongxia Feng, Steve Cho, Jung Kyu Han, Changhua Liu +4 more |
2025-06-24 |
|
| 12334422 |
Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates |
Kyle McElhinny, Onur Ozkan, Ali Lehaf, Steve Cho, Leonel Arana +4 more |
2025-06-17 |
|
| 12308329 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli |
2025-05-20 |
|
| 12255130 |
Airgap structures for high speed signal integrity |
Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Brandon C. Marin +4 more |
2025-03-18 |
|
| 12209711 |
Flammable and explosive liquid transportation system and method and application thereof |
Bo Li, Sichuan LIU, Wenjun Liu, Changbin WANG, Hongbo Tan +1 more |
2025-01-28 |
|
| 12142567 |
Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density |
Xiao Di SUN ZHOU, Debendra Mallik |
2024-11-12 |
$28,491,000 |
| 11990427 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli |
2024-05-21 |
$18,840,000 |
| 11973041 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli |
2024-04-30 |
$26,151,000 |
| 11955448 |
Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches |
Jung Kyu Han, Hongxia Feng, Rahul N. Manepalli |
2024-04-09 |
$27,197,000 |
| 11948898 |
Etch barrier for microelectronic packaging conductive structures |
Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Benjamin Duong |
2024-04-02 |
$34,819,000 |
| 11942334 |
Microelectronic assemblies having conductive structures with different thicknesses |
Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh +1 more |
2024-03-26 |
$33,708,000 |
| 11881182 |
Light-emitting device driver chip, backlight module, and display panel |
— |
2024-01-23 |
|
| 11769735 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli |
2023-09-26 |
$20,953,000 |
| 11763760 |
Backlight module and display device |
Junyao Fan |
2023-09-19 |
|
| 11483421 |
Terminal device |
Linchuan Wang |
2022-10-25 |
|
| 11404389 |
In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages |
Jeremy Ecton, Suddhasattwa Nad, Kristof Darmawikarta, Yonggang Li |
2022-08-02 |
$13,520,000 |
| 11088103 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more |
2021-08-10 |
$36,027,000 |
