XG

Xiaoying Guo

IN Intel: 15 patents #2,741 of 30,777Top 9%
TC Tcl China Star Optoelectronics Technology Co.: 2 patents #153 of 470Top 35%
Xiaomi: 1 patents #677 of 1,395Top 50%
Overall (All Time): #227,706 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12354883 Omni directional interconnect with magnetic fillers in mold matrix Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more 2025-07-08
12354992 First layer interconnect first on carrier approach for EMIB patch Changhua Liu, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more 2025-07-08
12341117 Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates Kyle McElhinny, Hongxia Feng, Steve Cho, Jung Kyu Han, Changhua Liu +4 more 2025-06-24
12334422 Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates Kyle McElhinny, Onur Ozkan, Ali Lehaf, Steve Cho, Leonel Arana +4 more 2025-06-17
12308329 Chiplet first architecture for die tiling applications Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli 2025-05-20
12255130 Airgap structures for high speed signal integrity Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Brandon C. Marin +4 more 2025-03-18
12209711 Flammable and explosive liquid transportation system and method and application thereof Bo Li, Sichuan LIU, Wenjun Liu, Changbin WANG, Hongbo Tan +1 more 2025-01-28
12142567 Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density Xiao Di SUN ZHOU, Debendra Mallik 2024-11-12
11990427 Chiplet first architecture for die tiling applications Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli 2024-05-21
11973041 Chiplet first architecture for die tiling applications Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli 2024-04-30
11955448 Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches Jung Kyu Han, Hongxia Feng, Rahul N. Manepalli 2024-04-09
11948898 Etch barrier for microelectronic packaging conductive structures Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Benjamin Duong 2024-04-02
11942334 Microelectronic assemblies having conductive structures with different thicknesses Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh +1 more 2024-03-26
11881182 Light-emitting device driver chip, backlight module, and display panel 2024-01-23
11769735 Chiplet first architecture for die tiling applications Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli 2023-09-26
11763760 Backlight module and display device Junyao Fan 2023-09-19
11483421 Terminal device Linchuan Wang 2022-10-25
11404389 In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages Jeremy Ecton, Suddhasattwa Nad, Kristof Darmawikarta, Yonggang Li 2022-08-02
11088103 First layer interconnect first on carrier approach for EMIB patch Changhua Liu, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more 2021-08-10