Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Veronica Strong +1 more | 2024-03-26 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Leonel Arana +2 more | 2023-08-08 |
| 11506982 | Prism-mask for angled patterning applications | Keith J. Martin, Changhua Liu, Leonel Arana | 2022-11-22 |
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Leonel Arana +2 more | 2022-06-28 |
| 10910327 | Electronic device package with reduced thickness variation | Yonggang Li, Brandon C. Marin, Jeremy Ecton | 2021-02-02 |