| 12444619 |
Physical vapor deposition seeding for high aspect ratio vias in glass core technology |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Neelam Prabhu Gaunkar |
2025-10-14 |
|
| 12424719 |
Compact surface transmission line waveguides with vertical ground planes |
Telesphor Kamgaing, Neelam Prabhu Gaunkar, Georgios Dogiamis, Aleksandar Aleksov |
2025-09-23 |
|
| 12424716 |
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing |
2025-09-23 |
|
| 12400934 |
Dielectric film coating for through glass vias and plane surface roughness mitigation |
Robert Jordan, Telesphor Kamgaing |
2025-08-26 |
|
| 12368091 |
Package substrate with glass core having vertical power planes for improved power delivery |
Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Neelam Prabhu Gaunkar |
2025-07-22 |
|
| 12347761 |
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan |
2025-07-01 |
|
| 12205902 |
High-density interconnects for integrated circuit packages |
Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff |
2025-01-21 |
|
| 12153032 |
Interconnected corrugated carbon-based network |
Maher F. El-Kady, Richard B. Kaner |
2024-11-26 |
|
| 11942334 |
Microelectronic assemblies having conductive structures with different thicknesses |
Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh +1 more |
2024-03-26 |
$33,708,000 |
| 11915870 |
Capacitor with electrodes made of an interconnected corrugated carbon-based network |
Maher F. El-Kady, Richard B. Kaner |
2024-02-27 |
|
| 11784181 |
Die backend diodes for electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan |
2023-10-10 |
$20,947,000 |
| 11749628 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more |
2023-09-05 |
$19,899,000 |
| 11751367 |
Microelectronic package electrostatic discharge (ESD) protection |
Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid |
2023-09-05 |
$19,899,000 |
| 11728258 |
Electroless metal-defined thin pad first level interconnects for lithographically defined vias |
Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar |
2023-08-15 |
$18,845,000 |
| 11694951 |
Zero-misalignment two-via structures |
Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan |
2023-07-04 |
|
| 11676918 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov |
2023-06-13 |
$22,204,000 |
| 11664303 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings |
2023-05-30 |
$16,378,000 |
| 11621236 |
Electrostatic discharge protection in integrated circuits using positive temperature coefficient material |
Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan |
2023-04-04 |
$21,090,000 |
| 11581238 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Jimin Yao |
2023-02-14 |
$12,790,000 |
| 11527501 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more |
2022-12-13 |
$11,573,000 |
| 11502037 |
Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating |
Aleksandar Aleksov, Brandon M. Rawlings |
2022-11-15 |
$16,955,000 |
| 11460499 |
Dual sided thermal management solutions for integrated circuit packages |
Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff |
2022-10-04 |
$13,460,000 |
| 11424239 |
Diodes for package substrate electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan |
2022-08-23 |
$15,804,000 |
| 11397173 |
Interconnected corrugated carbon-based network |
Maher F. El-Kady, Richard B. Kaner |
2022-07-26 |
|
| 11348882 |
Package spark gap structure |
Aleksandar Aleksov, Feras Eid, Johanna M. Swan, Adel A. Elsherbini |
2022-05-31 |
$16,893,000 |
