Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424716 | RF filters and multiplexers manufactured in the core of a package substrate using glass core technology | Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing | 2025-09-23 |
| 12424719 | Compact surface transmission line waveguides with vertical ground planes | Telesphor Kamgaing, Neelam Prabhu Gaunkar, Georgios Dogiamis, Aleksandar Aleksov | 2025-09-23 |
| 12400934 | Dielectric film coating for through glass vias and plane surface roughness mitigation | Robert Jordan, Telesphor Kamgaing | 2025-08-26 |
| 12368091 | Package substrate with glass core having vertical power planes for improved power delivery | Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Neelam Prabhu Gaunkar | 2025-07-22 |
| 12347761 | Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate | Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan | 2025-07-01 |
| 12205902 | High-density interconnects for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2025-01-21 |
| 12153032 | Interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2024-11-26 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh +1 more | 2024-03-26 |
| 11915870 | Capacitor with electrodes made of an interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2024-02-27 |
| 11784181 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2023-10-10 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2023-09-05 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2023-09-05 |
| 11728258 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar | 2023-08-15 |
| 11694951 | Zero-misalignment two-via structures | Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan | 2023-07-04 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2023-06-13 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings | 2023-05-30 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2023-04-04 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Jimin Yao | 2023-02-14 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2022-12-13 |
| 11502037 | Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating | Aleksandar Aleksov, Brandon M. Rawlings | 2022-11-15 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2022-10-04 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2022-08-23 |
| 11397173 | Interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2022-07-26 |
| 11348882 | Package spark gap structure | Aleksandar Aleksov, Feras Eid, Johanna M. Swan, Adel A. Elsherbini | 2022-05-31 |
| 11328996 | Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating | Aleksandar Aleksov, Brandon M. Rawlings | 2022-05-10 |