Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205902 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff | 2025-01-21 |
| 12183961 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2024-12-31 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2024-06-04 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Jagat Shakya, Johanna M. Swan +3 more | 2023-09-05 |
| 11694951 | Zero-misalignment two-via structures | Veronica Strong, Aleksandar Aleksov, Johanna M. Swan | 2023-07-04 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Veronica Strong | 2023-05-30 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Jagat Shakya, Johanna M. Swan +3 more | 2022-12-13 |
| 11502037 | Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating | Aleksandar Aleksov, Veronica Strong | 2022-11-15 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Aleksandar Aleksov, Veronica Strong, Johanna M. Swan, Shawna M. Liff | 2022-10-04 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff +2 more | 2022-07-19 |
| 11328996 | Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating | Veronica Strong, Aleksandar Aleksov | 2022-05-10 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2022-01-18 |
| 11222836 | Zero-misalignment two-via structures | Veronica Strong, Aleksandar Aleksov, Johanna M. Swan | 2022-01-11 |
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff | 2021-09-28 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Veronica Strong | 2021-08-24 |
| 11095012 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2021-08-17 |
| 11031666 | Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more | 2021-06-08 |
| 11024933 | Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer | Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more | 2021-06-01 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Veronica Strong, Johanna M. Swan | 2021-05-04 |
| 10950919 | System comprising first and second servers interconnected by a plurality of joined waveguide sections | Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Aleksandar Aleksov +3 more | 2021-03-16 |
| 10645813 | Zero-misalignment via-pad structures | Henning Braunisch | 2020-05-05 |
| 10595410 | Non-planar on-package via capacitor | Fay Hua, Georgios Dogiamis, Telesphor Kamgaing | 2020-03-17 |
| 10593636 | Platform with thermally stable wireless interconnects | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Feras Eid | 2020-03-17 |
| 10476545 | Communication between integrated circuit packages using a millimeter-wave wireless radio fabric | Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis | 2019-11-12 |
| 10452571 | Microelectronic package communication using radio interfaces connected through waveguides | Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Georgios Dogiamis | 2019-10-22 |