| 12205902 |
High-density interconnects for integrated circuit packages |
Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff |
2025-01-21 |
|
| 12183961 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more |
2024-12-31 |
$16,542,000 |
| 12002745 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more |
2024-06-04 |
$24,500,000 |
| 11749628 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Jagat Shakya, Johanna M. Swan +3 more |
2023-09-05 |
$19,899,000 |
| 11694951 |
Zero-misalignment two-via structures |
Veronica Strong, Aleksandar Aleksov, Johanna M. Swan |
2023-07-04 |
|
| 11664303 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Veronica Strong |
2023-05-30 |
$16,378,000 |
| 11527501 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Jagat Shakya, Johanna M. Swan +3 more |
2022-12-13 |
$11,573,000 |
| 11502037 |
Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating |
Aleksandar Aleksov, Veronica Strong |
2022-11-15 |
$16,955,000 |
| 11460499 |
Dual sided thermal management solutions for integrated circuit packages |
Henning Braunisch, Aleksandar Aleksov, Veronica Strong, Johanna M. Swan, Shawna M. Liff |
2022-10-04 |
$13,460,000 |
| 11394094 |
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements |
Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff +2 more |
2022-07-19 |
$11,394,000 |
| 11328996 |
Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating |
Veronica Strong, Aleksandar Aleksov |
2022-05-10 |
$19,182,000 |
| 11227825 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more |
2022-01-18 |
$31,898,000 |
| 11222836 |
Zero-misalignment two-via structures |
Veronica Strong, Aleksandar Aleksov, Johanna M. Swan |
2022-01-11 |
$33,310,000 |
| 11133263 |
High-density interconnects for integrated circuit packages |
Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff |
2021-09-28 |
$36,743,000 |
| 11101205 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Veronica Strong |
2021-08-24 |
$32,164,000 |
| 11095012 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more |
2021-08-17 |
$29,127,000 |
| 11031666 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric |
Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more |
2021-06-08 |
$26,946,000 |
| 11024933 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer |
Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more |
2021-06-01 |
$35,542,000 |
| 10998272 |
Organic interposers for integrated circuit packages |
Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Veronica Strong, Johanna M. Swan |
2021-05-04 |
$37,420,000 |
| 10950919 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections |
Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Aleksandar Aleksov +3 more |
2021-03-16 |
$38,556,000 |
| 10645813 |
Zero-misalignment via-pad structures |
Henning Braunisch |
2020-05-05 |
$29,615,000 |
| 10593636 |
Platform with thermally stable wireless interconnects |
Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Feras Eid |
2020-03-17 |
$21,927,000 |
| 10595410 |
Non-planar on-package via capacitor |
Fay Hua, Georgios Dogiamis, Telesphor Kamgaing |
2020-03-17 |
$21,927,000 |
| 10476545 |
Communication between integrated circuit packages using a millimeter-wave wireless radio fabric |
Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis |
2019-11-12 |
$21,873,000 |
| 10452571 |
Microelectronic package communication using radio interfaces connected through waveguides |
Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Georgios Dogiamis |
2019-10-22 |
$16,310,000 |
