Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sacrificial redistribution layer in microelectronic assemblies having direct bonding

Sacrificial redistribution layer in microelectronic assemblies having direct bonding

US Patent 11749628 · Granted Sep 5, 2023

Estimated economic value: $19,899,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
Fine-grained disaggregated server architecture2025
Fine-grained disaggregated server architecture2025
Packaging architectures for sub-terahertz radio frequency devices2025