Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12163982 | Microbump cluster probing architecture for 2.5D and 3D dies | Ethan Caughey, Joseph Parks | 2024-12-10 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Johanna M. Swan +3 more | 2023-09-05 |
| 11740282 | Apparatuses and methods for monitoring health of probing u-bump cluster using current divider | Joseph Parks, Ethan Caughey, Ashwin Ashok, Prasanna Thiyagasundaram | 2023-08-29 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Johanna M. Swan +3 more | 2022-12-13 |
| 11486923 | Apparatuses and methods for mitigating sticking of units-under-test | Ethan Caughey, Jeremy Alan Streifer | 2022-11-01 |