Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12163982 | Microbump cluster probing architecture for 2.5D and 3D dies | Jagat Shakya, Joseph Parks | 2024-12-10 | $13,394,000 |
| 11740282 | Apparatuses and methods for monitoring health of probing u-bump cluster using current divider | Jagat Shakya, Joseph Parks, Ashwin Ashok, Prasanna Thiyagasundaram | 2023-08-29 | $19,273,000 |
| 11486923 | Apparatuses and methods for mitigating sticking of units-under-test | Jagat Shakya, Jeremy Alan Streifer | 2022-11-01 | $18,130,000 |
| 10429439 | In die stepping sort | Dae-Woo Kim, J. Daniel Bryan, Joseph Parks, Mark W. Dryfuse | 2019-10-01 | $22,201,000 |
| 10101381 | Space transformation methods | Erkan Acar, Pooya Tadayon, Armen Y. Balian | 2018-10-16 | $21,459,000 |