Issued Patents All Time
Showing 25 most recent of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12331373 | Steel material, for pressure vessel, showing excellent hydrogen-induced cracking resistance and method for preparing same | Woo-Yeol Cha | 2025-06-17 |
| 12261164 | Semiconductor package | Sang Cheon Park, Taehun Kim, Hyuekjae Lee | 2025-03-25 |
| 12243812 | Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages | Sujit Sharan | 2025-03-04 |
| 12237308 | Semiconductor package | Hyuekjae Lee, Eunseok Song | 2025-02-25 |
| 12227826 | Steel plate for pressure vessel having excellent hydrogen induced cracking resistance and method of manufacturing same | — | 2025-02-18 |
| 12221682 | Ultrahigh-strength steel having excellent cold workability and SSC resistance, and manufacturing method therefor | Young-Jin Jung | 2025-02-11 |
| 12170253 | Metal-free frame design for silicon bridges for semiconductor packages | Sujit Sharan, Sairam Agraharam | 2024-12-17 |
| 12142553 | Guard ring design enabling in-line testing of silicon bridges for semiconductor packages | Arnab Sarkar, Sujit Sharan | 2024-11-12 |
| 12134800 | Highly thick steel material having excellent low-temperature impact toughness and manufacturing method therefor | — | 2024-11-05 |
| 12074121 | Metal-free frame design for silicon bridges for semiconductor packages | Sujit Sharan, Sairam Agraharam | 2024-08-27 |
| 11901336 | Semiconductor package | Hyuekjae Lee, Eunseok Song | 2024-02-13 |
| 11848259 | Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages | Sujit Sharan | 2023-12-19 |
| 11798929 | Semiconductor package | Sang Cheon Park, Hyuekjae Lee, Taehun Kim | 2023-10-24 |
| 11784150 | Rounded metal trace corner for stress reduction | Ajay Jain, Neha M. Patel, Rodrick J. Hendricks, Sujit Sharan | 2023-10-10 |
| 11776916 | Semiconductor package | Sang Cheon Park, Young-Min Lee, Hyuek Jae Lee | 2023-10-03 |
| 11712658 | Environmental equipment and power generation system using same | Sung Ho Hong | 2023-08-01 |
| 11676889 | Guard ring design enabling in-line testing of silicon bridges for semiconductor packages | Arnab Sarkar, Sujit Sharan | 2023-06-13 |
| 11656765 | DBI circuit and memory device including the same | Yong Sang PARK, Min Soo LIM, Young Duke Seo | 2023-05-23 |
| 11634785 | Steel material showing excellent hydrogen-induced cracking resistance and method for preparing same | — | 2023-04-25 |
| 11626372 | Metal-free frame design for silicon bridges for semiconductor packages | Sujit Sharan, Sairam Agraharam | 2023-04-11 |
| 11624101 | Steel for pressure vessel having excellent surface quality and impact toughness, and method for manufacturing same | Tae-Il So, Sang-Deok Kang | 2023-04-11 |
| 11578376 | Steel for pressure vessels having excellent resistance to hydrogen induced cracking and manufacturing method thereof | Woo-Yeol Cha | 2023-02-14 |
| 11380643 | Rounded metal trace corner for stress reduction | Ajay Jain, Neha M. Patel, Rodrick J. Hendricks, Sujit Sharan | 2022-07-05 |
| 11322445 | EMIB copper layer for signal and power routing | Yidnekachew S. Mekonnen, Kemal Aygun, Sujit Sharan | 2022-05-03 |
| 11282792 | Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads | Young Kun Jee, Hae-Jung Yu, Sangwon Kim, Un-Byoung Kang, Jongho Lee +1 more | 2022-03-22 |