Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12073906 | Package pin pattern for device-to-device connection | Chong J. Zhao, James A. McCall, Robert J. Friar, San K. Chhay | 2024-08-27 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Aleksandar Aleksov +3 more | 2023-10-17 |
| 11742293 | Multiple die package using an embedded bridge connecting dies | Kemel Aygun, Ravindranath V. Mahajan, Christopher S. Baldwin, Rajasekaran Swaminathan | 2023-08-29 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Zhichao Zhang, Jianyong Xie | 2023-07-04 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Jianyong Xie, Zhiguo Qian, Kemal Aygun | 2023-01-03 |
| 11437366 | Tunable passive semiconductor elements | Zhichao Zhang, Kemal Aygun | 2022-09-06 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Aleksandar Aleksov +3 more | 2022-05-10 |
| 11322445 | EMIB copper layer for signal and power routing | Dae-Woo Kim, Kemal Aygun, Sujit Sharan | 2022-05-03 |
| 11276635 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Zhichao Zhang, Jianyong Xie | 2022-03-15 |
| 11145583 | Method to achieve variable dielectric thickness in packages for better electrical performance | Digvijay A. Raorane | 2021-10-12 |
| 10992342 | Simplified multimode signaling techniques | Kemal Aygun, Henning Braunisch | 2021-04-27 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more | 2021-04-06 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Aleksandar Aleksov +3 more | 2020-05-12 |
| 10410939 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more | 2019-09-10 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Zhiguo Qian, Kemal Aygun, Gregorio R. Murtagian, Sanka Ganesan +2 more | 2019-08-27 |
| 10186465 | Package-integrated microchannels | Feras Eid, Adel A. Elsherbini, Henning Braunisch, Krishna Bharath, Mathew J. Manusharow +2 more | 2019-01-22 |
| 9992859 | Low loss and low cross talk transmission lines using shaped vias | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Aleksandar Aleksov +3 more | 2018-06-05 |
| 9859253 | Integrated circuit package stack | Saikumar Jayaraman, John S. Guzek | 2018-01-02 |
| 9515031 | Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects | Nevin Altunyurt, Kemal Aygun, Kevin J. Doran | 2016-12-06 |