Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12340863 | Stacked memory chip solution with reduced package inputs/outputs (I/Os) | Shigeki Tomishima, Kuljit S. Bains, James A. McCall, Dimitrios Ziakas | 2025-06-24 |
| 12087352 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2024-09-10 |
| 12073906 | Package pin pattern for device-to-device connection | James A. McCall, Robert J. Friar, Yidnekachew S. Mekonnen, San K. Chhay | 2024-08-27 |
| 11776619 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-10-03 |
| 11621237 | Interposer and electronic package | Jonathan W. Thibado, Jeffory L. Smalley, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud | 2023-04-04 |
| 11569161 | Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds | James A. McCall, Michael Gutzmann | 2023-01-31 |
| 11557333 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-01-17 |
| 11056179 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2021-07-06 |
| 10884958 | DIMM for a high bandwidth memory channel | Rajat Agarwal, Bill Nale, James A. McCall, George Vergis | 2021-01-05 |
| 10592445 | Techniques to access or operate a dual in-line memory module via multiple data channels | Bill Nale, Christopher E. Cox, Kuljit S. Bains, George Vergis, James A. McCall +3 more | 2020-03-17 |
| 10146711 | Techniques to access or operate a dual in-line memory module via multiple data channels | Bill Nale, Kuljit S. Bains, George Vergis, Christopher E. Cox, James A. McCall +3 more | 2018-12-04 |
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more | 2017-11-28 |