Issued Patents All Time
Showing 25 most recent of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12373287 | Distribution of error checking and correction (ECC) bits to allocate ECC bits for metadata | Rajat Agarwal, Wei-Pin Chen, Bill Nale | 2025-07-29 |
| 12340863 | Stacked memory chip solution with reduced package inputs/outputs (I/Os) | Chong J. Zhao, Shigeki Tomishima, Kuljit S. Bains, Dimitrios Ziakas | 2025-06-24 |
| 12332739 | Buffer that supports burst transfers having parallel CRC and data transmissions | Bill Nale, Zibing Yang, Yanjie Zhu | 2025-06-17 |
| 12217787 | Apparatus, system and method to detect and improve an input clock performance of a memory device | Arvind Kumar, Bill Nale, John R. Goles, Dean-Dexter R. Eugenio | 2025-02-04 |
| 12087352 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2024-09-10 |
| 12073906 | Package pin pattern for device-to-device connection | Chong J. Zhao, Robert J. Friar, Yidnekachew S. Mekonnen, San K. Chhay | 2024-08-27 |
| 11776619 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-10-03 |
| 11657862 | Electrically coupled trace routing configuration in multiple layers | Rogelio Alfonso Moreyra Gonzalez, Jose Angel Ramos Martinez | 2023-05-23 |
| 11569161 | Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds | Chong J. Zhao, Michael Gutzmann | 2023-01-31 |
| 11557333 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2023-01-17 |
| 11335395 | Applying chip select for memory device identification and power management control | Christopher E. Cox, Kuljit S. Bains, Christopher P. Mozak, Akshith Vasanth, Bill Nale | 2022-05-17 |
| 11116072 | Discrete circuit having cross-talk noise cancellation circuitry and method thereof | Jun Liao, Zhen Zhou, Jong-Ru Guo, Xiang Li, Yunhui Chu +1 more | 2021-09-07 |
| 11074959 | DDR memory bus with a reduced data strobe signal preamble timespan | Christopher P. Mozak, Christopher E. Cox, Yan Fu, Robert J. Friar, Hsien-Pao Yang | 2021-07-27 |
| 11056179 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2021-07-06 |
| 10965047 | Connector with active circuit | Jong-Ru Guo, Yunhui Chu, Jun Liao, Kai Xiao, Jingbo Li +7 more | 2021-03-30 |
| 10963404 | High bandwidth DIMM | Rajat Agarwal, George Vergis, Bill Nale | 2021-03-30 |
| 10950536 | Packed interconnect structure with reduced cross coupled noise | Zhen Zhou, Jun Liao, Xiang Li, Kevin Stone, Daqiao Du +2 more | 2021-03-16 |
| 10943640 | Apparatus, method and system for providing termination for multiple chips of an integrated circuit package | Kuljit S. Bains, George Vergis, Ge Chang | 2021-03-09 |
| 10884958 | DIMM for a high bandwidth memory channel | Rajat Agarwal, Bill Nale, Chong J. Zhao, George Vergis | 2021-01-05 |
| 10839887 | Applying chip select for memory device identification and power management control | Christopher E. Cox, Kuljit S. Bains, Christopher P. Mozak, Akshith Vasanth, Bill Nale | 2020-11-17 |
| 10802996 | Dynamic bus inversion with programmable termination level to maintain programmable target ratio of ones and zeros in signal lines | Christopher P. Mozak, Bryan K. Casper | 2020-10-13 |
| 10729002 | Device, system and method to mitigate signal noise in communications with a memory module | Jun Liao, Xiang Li, Yunhui Chu, Jong-Ru Guo | 2020-07-28 |
| 10617000 | Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards | Daqiao Du, Zhen Zhou, Jun Liao, Xiang Li, Kai Xiao +1 more | 2020-04-07 |
| 10592445 | Techniques to access or operate a dual in-line memory module via multiple data channels | Bill Nale, Christopher E. Cox, Kuljit S. Bains, George Vergis, Chong J. Zhao +3 more | 2020-03-17 |
| 10552285 | Impedance compensation based on detecting sensor data | Kuljit S. Bains | 2020-02-04 |