| 12373287 |
Distribution of error checking and correction (ECC) bits to allocate ECC bits for metadata |
Rajat Agarwal, Wei-Pin Chen, Bill Nale |
2025-07-29 |
|
| 12340863 |
Stacked memory chip solution with reduced package inputs/outputs (I/Os) |
Chong J. Zhao, Shigeki Tomishima, Kuljit S. Bains, Dimitrios Ziakas |
2025-06-24 |
|
| 12332739 |
Buffer that supports burst transfers having parallel CRC and data transmissions |
Bill Nale, Zibing Yang, Yanjie Zhu |
2025-06-17 |
|
| 12217787 |
Apparatus, system and method to detect and improve an input clock performance of a memory device |
Arvind Kumar, Bill Nale, John R. Goles, Dean-Dexter R. Eugenio |
2025-02-04 |
|
| 12087352 |
Techniques to couple high bandwidth memory device on silicon substrate and package substrate |
Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains |
2024-09-10 |
|
| 12073906 |
Package pin pattern for device-to-device connection |
Chong J. Zhao, Robert J. Friar, Yidnekachew S. Mekonnen, San K. Chhay |
2024-08-27 |
$26,513,000 |
| 11776619 |
Techniques to couple high bandwidth memory device on silicon substrate and package substrate |
Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains |
2023-10-03 |
|
| 11657862 |
Electrically coupled trace routing configuration in multiple layers |
Rogelio Alfonso Moreyra Gonzalez, Jose Angel Ramos Martinez |
2023-05-23 |
$11,397,000 |
| 11569161 |
Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds |
Chong J. Zhao, Michael Gutzmann |
2023-01-31 |
$11,941,000 |
| 11557333 |
Techniques to couple high bandwidth memory device on silicon substrate and package substrate |
Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains |
2023-01-17 |
|
| 11335395 |
Applying chip select for memory device identification and power management control |
Christopher E. Cox, Kuljit S. Bains, Christopher P. Mozak, Akshith Vasanth, Bill Nale |
2022-05-17 |
$14,251,000 |
| 11116072 |
Discrete circuit having cross-talk noise cancellation circuitry and method thereof |
Jun Liao, Zhen Zhou, Jong-Ru Guo, Xiang Li, Yunhui Chu +1 more |
2021-09-07 |
$31,495,000 |
| 11074959 |
DDR memory bus with a reduced data strobe signal preamble timespan |
Christopher P. Mozak, Christopher E. Cox, Yan Fu, Robert J. Friar, Hsien-Pao Yang |
2021-07-27 |
$27,337,000 |
| 11056179 |
Techniques to couple high bandwidth memory device on silicon substrate and package substrate |
Chong J. Zhao, Shigeki Tomishima, George Vergis, Kuljit S. Bains |
2021-07-06 |
$31,309,000 |
| 10963404 |
High bandwidth DIMM |
Rajat Agarwal, George Vergis, Bill Nale |
2021-03-30 |
$32,599,000 |
| 10965047 |
Connector with active circuit |
Jong-Ru Guo, Yunhui Chu, Jun Liao, Kai Xiao, Jingbo Li +7 more |
2021-03-30 |
$32,599,000 |
| 10950536 |
Packed interconnect structure with reduced cross coupled noise |
Zhen Zhou, Jun Liao, Xiang Li, Kevin Stone, Daqiao Du +2 more |
2021-03-16 |
$38,556,000 |
| 10943640 |
Apparatus, method and system for providing termination for multiple chips of an integrated circuit package |
Kuljit S. Bains, George Vergis, Ge Chang |
2021-03-09 |
$45,039,000 |
| 10884958 |
DIMM for a high bandwidth memory channel |
Rajat Agarwal, Bill Nale, Chong J. Zhao, George Vergis |
2021-01-05 |
$27,050,000 |
| 10839887 |
Applying chip select for memory device identification and power management control |
Christopher E. Cox, Kuljit S. Bains, Christopher P. Mozak, Akshith Vasanth, Bill Nale |
2020-11-17 |
$36,756,000 |
| 10802996 |
Dynamic bus inversion with programmable termination level to maintain programmable target ratio of ones and zeros in signal lines |
Christopher P. Mozak, Bryan K. Casper |
2020-10-13 |
$29,561,000 |
| 10729002 |
Device, system and method to mitigate signal noise in communications with a memory module |
Jun Liao, Xiang Li, Yunhui Chu, Jong-Ru Guo |
2020-07-28 |
$26,273,000 |
| 10617000 |
Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards |
Daqiao Du, Zhen Zhou, Jun Liao, Xiang Li, Kai Xiao +1 more |
2020-04-07 |
$35,530,000 |
| 10592445 |
Techniques to access or operate a dual in-line memory module via multiple data channels |
Bill Nale, Christopher E. Cox, Kuljit S. Bains, George Vergis, Chong J. Zhao +3 more |
2020-03-17 |
$21,927,000 |
| 10552285 |
Impedance compensation based on detecting sensor data |
Kuljit S. Bains |
2020-02-04 |
$21,361,000 |
