Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8972685 | Method, apparatus and system for exchanging communications via a command/address bus | Kuljit S. Bains | 2015-03-03 |
| 8673391 | Method of manufacturing a circuit board | David Shykind | 2014-03-18 |
| 8415002 | Method of manufacturing a circuit board | David Shykind | 2013-04-09 |
| 8274308 | Method and apparatus for dynamic memory termination | Kuljit S. Bains | 2012-09-25 |
| 7772708 | Stacking integrated circuit dies | Michael W. Leddige, Ajit Deosthali, Brad Larson | 2010-08-10 |
| 7694060 | Systems with variable link widths based on estimated activity levels | Bruce A. Christenson | 2010-04-06 |
| 7676917 | Method of manufacturing a circuit board | David Shykind | 2010-03-16 |
| 7542322 | Buffered continuous multi-drop clock ring | Clinton Walker | 2009-06-02 |
| 7514773 | Systems and arrangements for interconnecting integrated circuit dies | Michael W. Leddige | 2009-04-07 |
| 7459200 | Circuit board design | David Shykind | 2008-12-02 |
| 7447929 | Countering power resonance | Joe Salmon | 2008-11-04 |
| 7446572 | Method and system for a configurable Vcc reference and Vss reference differential current mode transmitter | Hing Y. To, Michael Sandhinti | 2008-11-04 |
| 7246022 | Initiation of differential link retraining upon temperature excursion | Klaus Ruff, David Shykind | 2007-07-17 |
| 7194572 | Memory system and method to reduce reflection and signal degradation | Michael W. Leddige | 2007-03-20 |
| 7133962 | Circulator chain memory command and address bus topology | Michael W. Leddige | 2006-11-07 |
| 7010637 | Single-ended memory interface system | Hing Y. To | 2006-03-07 |
| 6918078 | Systems with modules sharing terminations | Michael W. Leddige | 2005-07-12 |
| 6820163 | Buffering data transfer between a chipset and memory modules | Randy M. Bonella, John B. Halbert, Jim M. Dodd, Chung Lam | 2004-11-16 |
| 6771515 | Systems having modules with on die terminations | Hing Y. To | 2004-08-03 |
| 6747483 | Differential memory interface system | Hing Y. To | 2004-06-08 |
| 6724082 | Systems having modules with selectable on die terminations | Hing Y. To, Michael W. Leddige | 2004-04-20 |
| 6717823 | Systems having modules with buffer chips | Hing To | 2004-04-06 |
| 6711640 | Split delay transmission line | Michael W. Leddige | 2004-03-23 |
| 6711027 | Modules having paths of different impedances | Hing“Thomas” Y. To | 2004-03-23 |
| 6708243 | Computer assembly with stub traces coupled to vias to add capacitance at the vias | Michael W. Leddige | 2004-03-16 |