| 12266878 |
Electrical interconnect with improved impedance |
Zhen Zhou, Ismael Franco Núñez, Gordon P. Melz |
2025-04-01 |
| 12196807 |
Near field wireless communication system for mother to package and package to package sideband digital communication |
Zhen Zhou, Renzhi Liu, Jong-Ru Guo, Kenneth P. Foust, Jason A. Mix +2 more |
2025-01-14 |
| 10950536 |
Packed interconnect structure with reduced cross coupled noise |
Zhen Zhou, Jun Liao, Xiang Li, Kevin Stone, Tae Young Yang +2 more |
2021-03-16 |
| 10617000 |
Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards |
Zhen Zhou, Jun Liao, James A. McCall, Xiang Li, Kai Xiao +1 more |
2020-04-07 |
| 10157822 |
Heterogeneous interconnect having linear and non-linear conductive pathways |
Zhen Zhou, Tae Young Yang, Guosong LIN, Ling Zheng |
2018-12-18 |
| 10074919 |
Board integrated interconnect |
Zhen Zhou, Anne M. Sepic, Kai Xiao |
2018-09-11 |