Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12266878 | Electrical interconnect with improved impedance | Zhen Zhou, Ismael Franco Núñez, Gordon P. Melz | 2025-04-01 | |
| 12196807 | Near field wireless communication system for mother to package and package to package sideband digital communication | Zhen Zhou, Renzhi Liu, Jong-Ru Guo, Kenneth P. Foust, Jason A. Mix +2 more | 2025-01-14 | |
| 10950536 | Packed interconnect structure with reduced cross coupled noise | Zhen Zhou, Jun Liao, Xiang Li, Kevin Stone, Tae Young Yang +2 more | 2021-03-16 | $38,556,000 |
| 10617000 | Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards | Zhen Zhou, Jun Liao, James A. McCall, Xiang Li, Kai Xiao +1 more | 2020-04-07 | $35,530,000 |
| 10157822 | Heterogeneous interconnect having linear and non-linear conductive pathways | Zhen Zhou, Tae Young Yang, Guosong LIN, Ling Zheng | 2018-12-18 | $25,622,000 |
| 10074919 | Board integrated interconnect | Zhen Zhou, Anne M. Sepic, Kai Xiao | 2018-09-11 | $19,778,000 |