Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Phil Geng, Mengqi Liu, David Shia, Sandeep Ahuja +1 more | 2025-05-27 |
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian +2 more | 2025-05-20 |
| 12279395 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Phil Geng, Ralph V. Miele, David Shia, Eric W. Buddrius, Sean T. Sivapalan +2 more | 2025-04-15 |
| 12131977 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more | 2024-10-29 |
| 11842943 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more | 2023-12-12 |
| 11683890 | Reflow grid array to support late attach of components | Jonathan W. Thibado, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud | 2023-06-20 |
| 11621237 | Interposer and electronic package | Jonathan W. Thibado, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud, Chong J. Zhao | 2023-04-04 |
| 11545408 | Reflowable grid array to support grid heating | Jonathan W. Thibado, John C. Gulick, Phi Thanh | 2023-01-03 |
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez +5 more | 2022-11-08 |
| 11488839 | Reflowable grid array as standby heater for reliability | Jonathan W. Thibado, John C. Gulick, Phi Thanh | 2022-11-01 |
| 11449111 | Scalable, high load, low stiffness, and small footprint loading mechanism | Eric W. Buddrius, Ralph V. Miele, Mohanraj Prabhugoud, David Shia | 2022-09-20 |
| 11038293 | Power bar package mount arrangement | Brian D. Aspnes, Weimin Shi | 2021-06-15 |
| 10880994 | Top-side connector interface for processor packaging | Russell S. Aoki, Jonathan W. Thibado | 2020-12-29 |
| 10455731 | Hydraulic bladder for CPU interconnection and cooling | Ralph W. Jensen, Kevin Ceurter, Devdatta P. Kulkarni, Casey Winkel | 2019-10-22 |
| 10455685 | Electronic device, socket, and spacer to alter socket profile | Steven A. Klein, Kuang Liu, Thomas A. Boyd, Luis Gil Rangel, Muffadal Mukadem +5 more | 2019-10-22 |
| 10418309 | Mechanical seal and reservoir for microelectronic packages | Bijoyraj Sahu, Thomas A. Boyd | 2019-09-17 |
| 10211120 | Rework grid array interposer with direct power | Russell S. Aoki, Jonathan W. Thibado, David J. Llapitan, Thomas A. Boyd, Harvey R. Kofstad +2 more | 2019-02-19 |
| 10205292 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more | 2019-02-12 |
| 10141241 | Multi-chip self adjusting cooling solution | Susan F. Smith, Mani N. Prakash, Tao Liu, Henry C. Bosak, Harvey R. Kofstad +1 more | 2018-11-27 |
| 9935033 | Heat sink coupling using flexible heat pipes for multi-surface components | Susan F. Smith, Mani N. Prakash, Thu Huynh | 2018-04-03 |
| 9859636 | Linear edge connector with activator bar and contact load spring | Thomas A. Boyd, Russell S. Aoki, Karumbu Meyyappan | 2018-01-02 |
| 9848510 | Socket loading element and associated techniques and configurations | Vijaykumar Krithivasan, David J. Llapitan, Gaurav Chawla, Mani N. Prakash, Susan F. Smith | 2017-12-19 |
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Ram Viswanath, Bassam N. Coury, Dimitrios Ziakas +11 more | 2017-11-28 |
| 9806003 | Single base multi-floating surface cooling solution | Susan F. Smith, Thu Huynh, Mani N. Prakash | 2017-10-31 |
| 9780510 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more | 2017-10-03 |