Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Phil Geng, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian, Ralph V. Miele +2 more | 2025-05-20 |
| 12133368 | Cooling mass and spring element for low insertion force hot swappable electronic component interface | Hardeep Singh, Rachit Sharma, Devdatta P. Kulkarni | 2024-10-29 |
| 12093092 | Heat transfer apparatus for a computer environment | Devdatta P. Kulkarni | 2024-09-17 |
| 11249522 | Heat transfer apparatus for a computer environment | Devdatta P. Kulkarni | 2022-02-15 |
| 9983641 | Tunable two phase liquid cooling thermal management method and apparatus | Devdatta P. Kulkarni | 2018-05-29 |
| 9917795 | Techniques to convert signals routed through a fabric cable assembly | — | 2018-03-13 |
| 9356372 | Techniques to convert signals routed through a fabric cable assembly | — | 2016-05-31 |