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Variable conductance heat pipes for improved reliability |
Devdatta P. Kulkarni |
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Flexible and modular top and bottom side processor unit module cooling |
Andres Ramirez Macias, Aardra B. Athalye, Devdatta P. Kulkarni, Gilberto Rayas Paredes |
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| 11387163 |
Scalable debris-free socket loading mechanism |
Andrew Larson, Craig Jahne, Eric W. Buddrius, Ralph V. Miele |
2022-07-12 |
| 11291115 |
Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets |
Shelby Ferguson, Russell S. Aoki, Thomas A. Boyd, Eric W. Buddrius, Kevin Ceurter +5 more |
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| 11032941 |
Modular thermal energy management designs for data center computing |
Minh Le, Thomas A. Boyd, Evan A. Chenelly, Christopher Wade Ackerman, Carlos Alvizo Flores +1 more |
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| 10418309 |
Mechanical seal and reservoir for microelectronic packages |
Thomas A. Boyd, Jeffory L. Smalley |
2019-09-17 |
| 9889653 |
Printhead with nanotips for nanoscale printing and manufacturing |
Peter J. Nystrom, Andrew W. Hays |
2018-02-13 |
| 9038269 |
Printhead with nanotips for nanoscale printing and manufacturing |
Peter J. Nystrom, Andrew W. Hays |
2015-05-26 |
| 8931879 |
Laser transmission laminating of materials for ink jet printheads |
Peter J. Nystrom, Mark A. Cellura |
2015-01-13 |
| 8919915 |
Ultrasonic laminating of materials for ink jet printheads |
Peter J. Nystrom, Mark A. Cellura |
2014-12-30 |
| 8727508 |
Bonded silicon structure for high density print head |
Peter J. Nystrom |
2014-05-20 |
