Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12345474 | Variable conductance heat pipes for improved reliability | Devdatta P. Kulkarni | 2025-07-01 |
| 12055986 | Flexible and modular top and bottom side processor unit module cooling | Andres Ramirez Macias, Aardra B. Athalye, Devdatta P. Kulkarni, Gilberto Rayas Paredes | 2024-08-06 |
| 11387163 | Scalable debris-free socket loading mechanism | Andrew Larson, Craig Jahne, Eric W. Buddrius, Ralph V. Miele | 2022-07-12 |
| 11291115 | Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets | Shelby Ferguson, Russell S. Aoki, Thomas A. Boyd, Eric W. Buddrius, Kevin Ceurter +5 more | 2022-03-29 |
| 11032941 | Modular thermal energy management designs for data center computing | Minh Le, Thomas A. Boyd, Evan A. Chenelly, Christopher Wade Ackerman, Carlos Alvizo Flores +1 more | 2021-06-08 |
| 10418309 | Mechanical seal and reservoir for microelectronic packages | Thomas A. Boyd, Jeffory L. Smalley | 2019-09-17 |
| 9889653 | Printhead with nanotips for nanoscale printing and manufacturing | Peter J. Nystrom, Andrew W. Hays | 2018-02-13 |
| 9038269 | Printhead with nanotips for nanoscale printing and manufacturing | Peter J. Nystrom, Andrew W. Hays | 2015-05-26 |
| 8931879 | Laser transmission laminating of materials for ink jet printheads | Peter J. Nystrom, Mark A. Cellura | 2015-01-13 |
| 8919915 | Ultrasonic laminating of materials for ink jet printheads | Peter J. Nystrom, Mark A. Cellura | 2014-12-30 |
| 8727508 | Bonded silicon structure for high density print head | Peter J. Nystrom | 2014-05-20 |