Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296009 | Method and apparatus for detaching a microprocessor from a heat sink | Rolf Laido, Divya Swamy Bandaru, Thomas A. Boyd, Jorge Contreras Perez, Mustafa H. Haswarey | 2022-04-05 |
| 11291115 | Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets | Bijoyraj Sahu, Russell S. Aoki, Thomas A. Boyd, Eric W. Buddrius, Kevin Ceurter +5 more | 2022-03-29 |
| 10455685 | Electronic device, socket, and spacer to alter socket profile | Steven A. Klein, Kuang Liu, Thomas A. Boyd, Luis Gil Rangel, Muffadal Mukadem +5 more | 2019-10-22 |
| 10260961 | Integrated circuit packages with temperature sensor traces | Rashelle Kay Yee, Russell S. Aoki, Michael Hui, Jonathon Robert Carstens, Joseph J. Jasniewski | 2019-04-16 |
| 10178763 | Warpage mitigation in printed circuit board assemblies | Rashelle Kay Yee, Russell S. Aoki, Michael Hui, Jonathon Robert Carstens, Joseph J. Jasniewski +1 more | 2019-01-08 |
| 9991223 | Semiconductor package alignment frame for local reflow | Russell S. Aoki, Michael Hui, Jonathon Robert Carstens, Michael S. Brazel, Daniel P. Carter +5 more | 2018-06-05 |