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Method and apparatus for detaching a microprocessor from a heat sink |
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2022-04-05 |
| 11291115 |
Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets |
Bijoyraj Sahu, Russell S. Aoki, Thomas A. Boyd, Eric W. Buddrius, Kevin Ceurter +5 more |
2022-03-29 |
| 10455685 |
Electronic device, socket, and spacer to alter socket profile |
Steven A. Klein, Kuang Liu, Thomas A. Boyd, Luis Gil Rangel, Muffadal Mukadem +5 more |
2019-10-22 |
| 10260961 |
Integrated circuit packages with temperature sensor traces |
Rashelle Kay Yee, Russell S. Aoki, Michael Hui, Jonathon Robert Carstens, Joseph J. Jasniewski |
2019-04-16 |
| 10178763 |
Warpage mitigation in printed circuit board assemblies |
Rashelle Kay Yee, Russell S. Aoki, Michael Hui, Jonathon Robert Carstens, Joseph J. Jasniewski +1 more |
2019-01-08 |
| 9991223 |
Semiconductor package alignment frame for local reflow |
Russell S. Aoki, Michael Hui, Jonathon Robert Carstens, Michael S. Brazel, Daniel P. Carter +5 more |
2018-06-05 |