Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10680367 | Cable retention assemblies including torsional elements | Feifei Cheng, Kuang Liu, Michael Garcia, Eric W. Buddrius, Kevin Ceurter +1 more | 2020-06-09 | $37,008,000 |
| 10260961 | Integrated circuit packages with temperature sensor traces | Shelby Ferguson, Rashelle Kay Yee, Russell S. Aoki, Michael Hui, Joseph J. Jasniewski | 2019-04-16 | $24,207,000 |
| 10178763 | Warpage mitigation in printed circuit board assemblies | Rashelle Kay Yee, Russell S. Aoki, Shelby Ferguson, Michael Hui, Joseph J. Jasniewski +1 more | 2019-01-08 | $28,117,000 |
| 9991223 | Semiconductor package alignment frame for local reflow | Russell S. Aoki, Michael Hui, Michael S. Brazel, Daniel P. Carter, Thomas A. Boyd +5 more | 2018-06-05 | $24,427,000 |
| 9825387 | Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion | Feifei Cheng, Kuang Liu, Michael Garcia, Eric W. Buddrius, Kevin Ceurter | 2017-11-21 | $11,290,000 |