| 12160971 |
Jam for integration reliability of ruler form factor component |
Kristin L. Weldon |
2024-12-03 |
| 12131977 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more |
2024-10-29 |
| 11842943 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more |
2023-12-12 |
| 11266043 |
Liquid coolant based thermal energy management for containers receiving pluggable circuit modules |
Annie Chen, David Rodriguez, Juan G. Cevallos |
2022-03-01 |
| 11184997 |
System to reduce coolant use in an array of circuit boards |
Joseph Andrew Broderick, Eric D. McAfee, Juan G. Cevallos, Jaime Sanchez, Emery E. Frey |
2021-11-23 |
| 10945353 |
Mechanism with folded wrapping to seal components immersed in coolant |
Annie Chen, Jessica Gulbrand, Devdatta P. Kulkarni, Kristin L. Weldon, Joseph Andrew Broderick |
2021-03-09 |
| 9606589 |
Expansion card having synergistic cooling, structural and volume reduction solutions |
Mark Gallina, Jason B. Chesser, Mike MacGregor, Mark J. Luckeroth, Brian S. Jarrett +3 more |
2017-03-28 |
| 7770630 |
Modular capillary pumped loop cooling system |
Jason B. Chesser, Stephen Montgomery |
2010-08-10 |
| 7233491 |
Frame-level thermal interface component for transfer of heat from an electronic component of a computer system |
David S. De Lorenzo |
2007-06-19 |
| 7149086 |
Systems to cool multiple electrical components |
Tomm Aldridge |
2006-12-12 |
| 7133283 |
Frame-level thermal interface component for transfer of heat from an electronic component of a computer system |
David S. De Lorenzo |
2006-11-07 |
| 7079388 |
Baffles for high capacity air-cooling systems for electronics apparatus |
William E. Berry, Ven Holalkere |
2006-07-18 |
| 6981543 |
Modular capillary pumped loop cooling system |
Jason B. Chesser, Stephen Montgomery |
2006-01-03 |
| 6839237 |
Electronics rack assemblies and associated components |
William E. Berry, Robert J. Fite, Tomm Aldridge |
2005-01-04 |
| 6836407 |
Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure |
Ven Holalkere, Stephen Montgomery |
2004-12-28 |
| 6813149 |
High capacity air-cooling systems for electronic apparatus and associated methods |
William E. Berry, Ven Holalkere, David S. De Lorenzo |
2004-11-02 |
| 6776221 |
Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component |
Stephen Montgomery |
2004-08-17 |
| 6741465 |
Cooling method and apparatus for handheld devices |
Ven Holalkere |
2004-05-25 |
| 6700785 |
Computer system which locks a server unit subassembly in a selected position in a support frame |
William E. Berry, David S. De Lorenzo, Stephen Montgomery |
2004-03-02 |
| 6693797 |
Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another |
David S. De Lorenzo, Stephen Montgomery |
2004-02-17 |
| 6643132 |
Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system |
David S. De Lorenzo |
2003-11-04 |
| 6560114 |
Rack-mounted server and associated methods |
William E. Berry, Robert J. Fite, Tomm Aldridge |
2003-05-06 |