| 12219706 |
Removable and low insertion force connector system |
Aaron Gorius, Michael T. Crocker, Matthew J. Adiletta, John C. Gulick, Emery E. Frey |
2025-02-04 |
| 12082370 |
System device aggregation in a liquid cooling environment |
Aaron Gorius, Michael T. Crocker, Matthew J. Adiletta, John C. Gulick, Emery E. Frey |
2024-09-03 |
| 11683890 |
Reflow grid array to support late attach of components |
Jeffory L. Smalley, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud |
2023-06-20 |
| 11621237 |
Interposer and electronic package |
Jeffory L. Smalley, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud, Chong J. Zhao |
2023-04-04 |
| 11545408 |
Reflowable grid array to support grid heating |
Jeffory L. Smalley, John C. Gulick, Phi Thanh |
2023-01-03 |
| 11488839 |
Reflowable grid array as standby heater for reliability |
Jeffory L. Smalley, John C. Gulick, Phi Thanh |
2022-11-01 |
| 11023247 |
Processor package with optimization based on package connection type |
Daniel Willis, Eugene Nelson |
2021-06-01 |
| 10880994 |
Top-side connector interface for processor packaging |
Russell S. Aoki, Jeffory L. Smalley |
2020-12-29 |
| 10211120 |
Rework grid array interposer with direct power |
Russell S. Aoki, Jeffory L. Smalley, David J. Llapitan, Thomas A. Boyd, Harvey R. Kofstad +2 more |
2019-02-19 |
| 9832876 |
CPU package substrates with removable memory mechanical interfaces |
Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more |
2017-11-28 |
| 9603276 |
Electronic assembly that includes a plurality of electronic packages |
David J. Llapitan, Jeffory L. Smalley, Gaurav Chawla, Joshua D. Heppner, Vijaykumar Krithivasan +2 more |
2017-03-21 |