| 12489032 |
Cooling of conformal power delivery structures |
Aleksandar Aleksov, Henning Braunisch, Adel A. Elsherbini, Thomas L. Sounart, Johanna M. Swan |
2025-12-02 |
|
| 12482779 |
Hybrid backside thermal structures for enhanced ic packages |
Joe Walczyk, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala |
2025-11-25 |
|
| 12456702 |
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets |
Kimin Jun, Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +1 more |
2025-10-28 |
|
| 12438087 |
High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries |
Adel A. Elsherbini, Aleksandar Aleksov, Weiyi Li, Stephen L. Morein, Yoshihiro Tomita |
2025-10-07 |
|
| 12431430 |
Technologies for high throughput additive manufacturing for integrated circuit components |
Yoshihiro Tomita, Aleksandar Aleksov, Adel A. Elsherbini, Wenhao Li, Stephen L. Morein |
2025-09-30 |
|
| 12381182 |
Direct bonding in microelectronic assemblies |
Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan |
2025-08-05 |
|
| 12374626 |
Architectures and methods of fabricating 3D stacked packages |
Vijay K. Nair, Thomas L. Sounart |
2025-07-29 |
|
| 12327775 |
Thermal performance in hybrid bonded 3D die stacks |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov, Julien Sebot |
2025-06-10 |
|
| 12300579 |
Liquid cooled interposer for integrated circuit stack |
Georgios Dogiamis, Qiang Yu, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more |
2025-05-13 |
|
| 12266682 |
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies |
Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more |
2025-04-01 |
|
| 12261097 |
Thermal management in integrated circuit packages |
Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2025-03-25 |
|
| 12242290 |
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures |
Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more |
2025-03-04 |
|
| 12199018 |
Direct bonding in microelectronic assemblies |
Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Aleksandar Aleksov +3 more |
2025-01-14 |
|
| 12199012 |
Modular microchannel thermal solutions for integrated circuit devices |
Adel A. Elsherbini, Stephen L. Morein, Georgios Dogiamis |
2025-01-14 |
|
| 12170244 |
High-throughput additively manufactured power delivery vias and traces |
Adel A. Elsherbini, Georgios Dogiamis, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more |
2024-12-17 |
$33,648,000 |
| 12165962 |
Hermetic sealing structures in microelectronic assemblies having direct bonding |
Aleksandar Aleksov, Mohammad Enamul Kabir, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan |
2024-12-10 |
$13,394,000 |
| 12155133 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov |
2024-11-26 |
$26,820,000 |
| 12155372 |
Multi-filter die |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2024-11-26 |
$26,820,000 |
| 12142543 |
Thermal management solutions for embedded integrated circuit devices |
Johanna M. Swan, Adel A. Elsherbini |
2024-11-12 |
$28,491,000 |
| 12142510 |
Carrier for microelectronic assemblies having direct bonding |
Shawna M. Liff, Johanna M. Swan, Adel A. Elsherbini, Michael Baker, Aleksandar Aleksov |
2024-11-12 |
$28,491,000 |
| 12136577 |
Integrated circuit die packages including a contiguous heat spreader |
Joe Walczyk, Paul Diglio |
2024-11-05 |
$48,202,000 |
| 12113048 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff |
2024-10-08 |
$19,971,000 |
| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more |
2024-10-01 |
$20,560,000 |
| 12087682 |
Power delivery structures |
Adel A. Elsherbini, Georgios Dogiamis, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more |
2024-09-10 |
$16,964,000 |
| 12080620 |
Additively manufactured structures for heat dissipation from integrated circuit devices |
Xavier Francois Brun, Paul Diglio, Joe Walczyk, Sergio Antonio Chan Arguedas |
2024-09-03 |
$14,017,000 |
