Issued Patents All Time
Showing 25 most recent of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431430 | Technologies for high throughput additive manufacturing for integrated circuit components | Yoshihiro Tomita, Aleksandar Aleksov, Adel A. Elsherbini, Wenhao Li, Stephen L. Morein | 2025-09-30 |
| 12381182 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan | 2025-08-05 |
| 12374626 | Architectures and methods of fabricating 3D stacked packages | Vijay K. Nair, Thomas L. Sounart | 2025-07-29 |
| 12327775 | Thermal performance in hybrid bonded 3D die stacks | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov, Julien Sebot | 2025-06-10 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Qiang Yu, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more | 2025-05-13 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more | 2025-04-01 |
| 12261097 | Thermal management in integrated circuit packages | Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2025-03-25 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more | 2025-03-04 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Aleksandar Aleksov +3 more | 2025-01-14 |
| 12199012 | Modular microchannel thermal solutions for integrated circuit devices | Adel A. Elsherbini, Stephen L. Morein, Georgios Dogiamis | 2025-01-14 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Georgios Dogiamis, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more | 2024-12-17 |
| 12165962 | Hermetic sealing structures in microelectronic assemblies having direct bonding | Aleksandar Aleksov, Mohammad Enamul Kabir, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2024-12-10 |
| 12155372 | Multi-filter die | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2024-11-26 |
| 12155133 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2024-11-26 |
| 12142543 | Thermal management solutions for embedded integrated circuit devices | Johanna M. Swan, Adel A. Elsherbini | 2024-11-12 |
| 12142510 | Carrier for microelectronic assemblies having direct bonding | Shawna M. Liff, Johanna M. Swan, Adel A. Elsherbini, Michael Baker, Aleksandar Aleksov | 2024-11-12 |
| 12136577 | Integrated circuit die packages including a contiguous heat spreader | Joe Walczyk, Paul Diglio | 2024-11-05 |
| 12113048 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff | 2024-10-08 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more | 2024-10-01 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Georgios Dogiamis, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more | 2024-09-10 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Xavier Francois Brun, Paul Diglio, Joe Walczyk, Sergio Antonio Chan Arguedas | 2024-09-03 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more | 2024-08-13 |
| 12057402 | Direct bonding in microelectronic assemblies | Aleksandar Aleksov, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Randy B. Osborne +1 more | 2024-08-06 |
| 12040776 | Integrated radio frequency (RF) front-end module (FEM) | Telesphor Kamgaing, Aleksandar Aleksov, Georgios Dogiamis, Johanna M. Swan | 2024-07-16 |
| 12040307 | Magnetic induced heating for solder interconnects | Adel A. Elsherbini, Georgios Dogiamis | 2024-07-16 |