Issued Patents All Time
Showing 51–75 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621208 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Adel A. Elsherbini, Johanna M. Swan | 2023-04-04 |
| 11621192 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2023-04-04 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2023-04-04 |
| 11616047 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff | 2023-03-28 |
| 11615998 | Thermal management solutions for embedded integrated circuit devices | Johanna M. Swan, Adel A. Elsherbini | 2023-03-28 |
| 11551994 | Liquid metal TIM with STIM-like performance with no BSM and BGA compatible | Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot | 2023-01-10 |
| 11508898 | Piezoelectric devices fabricated in packaging build-up layers | Shawna M. Liff | 2022-11-22 |
| 11482472 | Thermal management solutions for stacked integrated circuit devices | Adel A. Elsherbini, Johanna M. Swan | 2022-10-25 |
| 11469206 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Lift | 2022-10-11 |
| 11456721 | RF front end module including hybrid filter and active circuits in a single package | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan | 2022-09-27 |
| 11421376 | Inorganic piezoelectric materials formed on fibers and applications thereof | Shawna M. Liff, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +2 more | 2022-08-23 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan | 2022-08-23 |
| 11417586 | Thermal management solutions for substrates in integrated circuit packages | Adel A. Elsherbini, Johanna M. Swan | 2022-08-16 |
| 11387161 | Package with thermal interface material retaining structures on die and heat spreader | — | 2022-07-12 |
| 11380624 | Electromagnetic interference shield created on package using high throughput additive manufacturing | Henning Braunisch, Shawna M. Liff, Georgios Dogiamis, Johanna M. Swan | 2022-07-05 |
| 11348882 | Package spark gap structure | Aleksandar Aleksov, Johanna M. Swan, Adel A. Elsherbini, Veronica Strong | 2022-05-31 |
| 11342243 | Thermal management solutions for embedded integrated circuit devices | Adel A. Elsherbini, Johanna M. Swan | 2022-05-24 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2022-05-10 |
| 11328986 | Capacitor-wirebond pad structures for integrated circuit packages | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan | 2022-05-10 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, Johanna M. Swan, John J. Beatty | 2022-05-10 |
| 11328978 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Johanna M. Swan, Sergio Antonio Chan Arguedas, John J. Beatty | 2022-05-10 |
| 11322456 | Die back side structures for warpage control | Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more | 2022-05-03 |
| 11316497 | Multi-filter die | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2022-04-26 |
| 11310907 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2022-04-19 |
| 11302618 | Microelectronic assemblies having substrate-integrated perovskite layers | Shawna M. Liff, Thomas L. Sounart, Johanna M. Swan | 2022-04-12 |