| 11676918 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong |
2023-06-13 |
$22,204,000 |
| 11658418 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov |
2023-05-23 |
$11,397,000 |
| 11652074 |
Semiconductor package with improved thermal blocks |
Johanna M. Swan |
2023-05-16 |
$11,130,000 |
| 11641711 |
Microelectronic package with substrate-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2023-05-02 |
$21,235,000 |
| 11621236 |
Electrostatic discharge protection in integrated circuits using positive temperature coefficient material |
Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan |
2023-04-04 |
$21,090,000 |
| 11621208 |
Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2023-04-04 |
$21,090,000 |
| 11621192 |
Inorganic dies with organic interconnect layers and related structures |
Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan |
2023-04-04 |
$21,090,000 |
| 11616047 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff |
2023-03-28 |
$20,940,000 |
| 11615998 |
Thermal management solutions for embedded integrated circuit devices |
Johanna M. Swan, Adel A. Elsherbini |
2023-03-28 |
$20,940,000 |
| 11551994 |
Liquid metal TIM with STIM-like performance with no BSM and BGA compatible |
Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot |
2023-01-10 |
$14,061,000 |
| 11508898 |
Piezoelectric devices fabricated in packaging build-up layers |
Shawna M. Liff |
2022-11-22 |
$12,862,000 |
| 11482472 |
Thermal management solutions for stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2022-10-25 |
$11,792,000 |
| 11469206 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Lift |
2022-10-11 |
$16,542,000 |
| 11456721 |
RF front end module including hybrid filter and active circuits in a single package |
Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan |
2022-09-27 |
$23,391,000 |
| 11421376 |
Inorganic piezoelectric materials formed on fibers and applications thereof |
Shawna M. Liff, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +2 more |
2022-08-23 |
$15,804,000 |
| 11424239 |
Diodes for package substrate electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan |
2022-08-23 |
$15,804,000 |
| 11417586 |
Thermal management solutions for substrates in integrated circuit packages |
Adel A. Elsherbini, Johanna M. Swan |
2022-08-16 |
$17,788,000 |
| 11387161 |
Package with thermal interface material retaining structures on die and heat spreader |
— |
2022-07-12 |
$13,106,000 |
| 11380624 |
Electromagnetic interference shield created on package using high throughput additive manufacturing |
Henning Braunisch, Shawna M. Liff, Georgios Dogiamis, Johanna M. Swan |
2022-07-05 |
$18,093,000 |
| 11348882 |
Package spark gap structure |
Aleksandar Aleksov, Johanna M. Swan, Adel A. Elsherbini, Veronica Strong |
2022-05-31 |
$16,893,000 |
| 11342243 |
Thermal management solutions for embedded integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2022-05-24 |
$18,289,000 |
| 11328978 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense |
Johanna M. Swan, Sergio Antonio Chan Arguedas, John J. Beatty |
2022-05-10 |
$19,182,000 |
| 11328979 |
Substrate integrated posts and heat spreader customization for enhanced package thermomechanics |
Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, Johanna M. Swan, John J. Beatty |
2022-05-10 |
$19,182,000 |
| 11328986 |
Capacitor-wirebond pad structures for integrated circuit packages |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan |
2022-05-10 |
$19,182,000 |
| 11329358 |
Low loss and low cross talk transmission lines having l-shaped cross sections |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2022-05-10 |
$19,182,000 |
