| 11322456 |
Die back side structures for warpage control |
Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more |
2022-05-03 |
$16,346,000 |
| 11316497 |
Multi-filter die |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2022-04-26 |
$25,630,000 |
| 11310907 |
Microelectronic package with substrate-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2022-04-19 |
$22,207,000 |
| 11302599 |
Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure |
Adel A. Elsherbini, Johanna M. Swan |
2022-04-12 |
$16,909,000 |
| 11302618 |
Microelectronic assemblies having substrate-integrated perovskite layers |
Shawna M. Liff, Thomas L. Sounart, Johanna M. Swan |
2022-04-12 |
$16,909,000 |
| 11296040 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong |
2022-04-05 |
$18,322,000 |
| 11289431 |
Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity |
Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan |
2022-03-29 |
$28,068,000 |
| 11282800 |
Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials |
Henning Braunisch, Georgios Dogiamis |
2022-03-22 |
$16,833,000 |
| 11282812 |
Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers |
Adel A. Elsherbini, Johanna M. Swan |
2022-03-22 |
$16,833,000 |
| 11283427 |
Hybrid filters and packages therefor |
Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan |
2022-03-22 |
$16,833,000 |
| 11264373 |
Die backend diodes for electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan |
2022-03-01 |
$16,941,000 |
| 11239155 |
Conductive contact structures for electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong |
2022-02-01 |
$16,992,000 |
| 11233015 |
Warpage mitigation structures created on substrate using high throughput additive manufacturing |
— |
2022-01-25 |
$21,146,000 |
| 11234343 |
Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices |
Adel A. Elsherbini, Johanna M. Swan |
2022-01-25 |
$21,146,000 |
| 11227825 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more |
2022-01-18 |
$31,898,000 |
| 11226162 |
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections |
Adel A. Elsherbini, Johanna M. Swan |
2022-01-18 |
$31,898,000 |
| 11227859 |
Stacked package with electrical connections created using high throughput additive manufacturing |
Johanna M. Swan, Shawna M. Liff |
2022-01-18 |
$31,898,000 |
| 11223524 |
Package integrated security features |
Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart +1 more |
2022-01-11 |
$33,310,000 |
| 11222856 |
Package-integrated bistable switch for electrostatic discharge (ESD) protection |
Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan |
2022-01-11 |
$33,310,000 |
| 11221354 |
Switched closed loop read-out methods and systems for resonant sensing platforms |
Georgios Dogiamis, Sasha N. Oster, Ian A. Young |
2022-01-11 |
$33,310,000 |
| 11206008 |
Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies |
Georgios Dogiamis, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan |
2021-12-21 |
$33,282,000 |
| 11189580 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Krishna Bharath, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong |
2021-11-30 |
$30,212,000 |
| 11158917 |
Dual-substrate waveguide filter |
Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan |
2021-10-26 |
$21,268,000 |
| 11147197 |
Microelectronic package electrostatic discharge (ESD) protection |
Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini |
2021-10-12 |
$32,982,000 |
| 11062947 |
Inorganic dies with organic interconnect layers and related structures |
Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan |
2021-07-13 |
$34,958,000 |