Issued Patents All Time
Showing 76–100 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302599 | Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure | Adel A. Elsherbini, Johanna M. Swan | 2022-04-12 |
| 11296040 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2022-04-05 |
| 11289431 | Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2022-03-29 |
| 11282800 | Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials | Henning Braunisch, Georgios Dogiamis | 2022-03-22 |
| 11283427 | Hybrid filters and packages therefor | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan | 2022-03-22 |
| 11282812 | Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers | Adel A. Elsherbini, Johanna M. Swan | 2022-03-22 |
| 11264373 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan | 2022-03-01 |
| 11239155 | Conductive contact structures for electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2022-02-01 |
| 11234343 | Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices | Adel A. Elsherbini, Johanna M. Swan | 2022-01-25 |
| 11233015 | Warpage mitigation structures created on substrate using high throughput additive manufacturing | — | 2022-01-25 |
| 11226162 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Adel A. Elsherbini, Johanna M. Swan | 2022-01-18 |
| 11227859 | Stacked package with electrical connections created using high throughput additive manufacturing | Johanna M. Swan, Shawna M. Liff | 2022-01-18 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2022-01-18 |
| 11221354 | Switched closed loop read-out methods and systems for resonant sensing platforms | Georgios Dogiamis, Sasha N. Oster, Ian A. Young | 2022-01-11 |
| 11223524 | Package integrated security features | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart +1 more | 2022-01-11 |
| 11222856 | Package-integrated bistable switch for electrostatic discharge (ESD) protection | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2022-01-11 |
| 11206008 | Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies | Georgios Dogiamis, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan | 2021-12-21 |
| 11189580 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Krishna Bharath, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2021-11-30 |
| 11158917 | Dual-substrate waveguide filter | Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2021-10-26 |
| 11147197 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini | 2021-10-12 |
| 11062947 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2021-07-13 |
| 11050155 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2021-06-29 |
| 11016288 | Adaptable displays using piezoelectric actuators | Sasha N. Oster, Johanna M. Swan, Thomas L. Sounart, Aleksandar Aleksov, Shawna M. Liff +2 more | 2021-05-25 |
| 11011470 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2021-05-18 |
| 10998879 | Monolithic die with acoustic wave resonators and active circuitry | Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2021-05-04 |