Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Inorganic dies with organic interconnect layers and related structures

Inorganic dies with organic interconnect layers and related structures

US Patent 11062947 · Granted Jul 13, 2021

Estimated economic value: $34,958,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Cooling of conformal power delivery structures2025
Cooling of conformal power delivery structures2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Contactless communication using a waveguide extending through a substrate core2025
Contactless communication using a waveguide extending through a substrate core2025