Issued Patents All Time
Showing 126–150 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch +3 more | 2019-11-12 |
| 10453635 | Package MEMS switch and method | Qing Ma, Johanna M. Swan, Valluri Rao | 2019-10-22 |
| 10432167 | Piezoelectric package-integrated crystal devices | Adel A. Elsherbini, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan +2 more | 2019-10-01 |
| 10424559 | Thermal management of molded packages | Nader N. Abazarnia, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster, Tannaz Harirchian +1 more | 2019-09-24 |
| 10418605 | Embedded formation of wearable and flexible batteries | Veronica Strong, Sasha N. Oster, Aranzazu MAESTRE CARO | 2019-09-17 |
| 10410939 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more | 2019-09-10 |
| 10386204 | Integrated sensor and homologous calibration structure for resonant devices | Sasha N. Oster, Thomas L. Sounart, Georgios Dogiamis | 2019-08-20 |
| 10381291 | Lithographacally defined vias for organic package substrate scaling | Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Aleksandar Aleksov, Javier Soto | 2019-08-13 |
| 10361142 | Dual-sided die packages | Henning Braunisch, Adel A. Elsherbini, Johanna M. Swan, Don Nelson | 2019-07-23 |
| 10325860 | Microelectronic bond pads having integrated spring structures | Robert L. Sankman, Sandeep B. Sane | 2019-06-18 |
| 10314171 | Package assembly with hermetic cavity | Aleksandar Aleksov, Johanna M. Swan | 2019-06-04 |
| 10305019 | Piezoelectric devices fabricated in packaging build-up layers | Shawna M. Liff | 2019-05-28 |
| 10291283 | Tunable radio frequency systems using piezoelectric package-integrated switching devices | Telesphor Kamgaing, Adel A. Elsherbini, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan +1 more | 2019-05-14 |
| 10282965 | Synthetic jet delivering controlled flow to sensor system | Jessica Gullbrand, Melissa A. Cowan, Chytra Pawashe | 2019-05-07 |
| 10264671 | Microelectronic devices designed with modular substrates having integrated fuses | — | 2019-04-16 |
| 10251272 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Aleksandar Aleksov, Thomas L. Sounart, Georgios Dogiamis, Johanna M. Swan | 2019-04-02 |
| 10215164 | Fabric-based piezoelectric energy harvesting | Nadine L. Dabby, Adel A. Elsherbini, Braxton Lathrop, Aleksandar Aleksov, Sasha N. Oster | 2019-02-26 |
| 10186465 | Package-integrated microchannels | Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath, Mathew J. Manusharow +2 more | 2019-01-22 |
| 10179729 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Sarah Haney, Weng Hong Teh, Sasha N. Oster | 2019-01-15 |
| 10156583 | Method of making an accelerometer | Qing Ma, Valluri Rao, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more | 2018-12-18 |
| 10134656 | Package integrated synthetic jet device | Jessica Gullbrand, Melissa A. Cowan | 2018-11-20 |
| 10121730 | Package integrated synthetic jet device | Jessica Gullbrand, Melissa A. Cowan | 2018-11-06 |
| 10116504 | Package integrated security features | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart +1 more | 2018-10-30 |
| 10083923 | Platform with thermally stable wireless interconnects | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Brandon M. Rawlings | 2018-09-25 |
| 10068852 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Nitin A. Deshpande, Shawna M. Liff | 2018-09-04 |