Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
FE

Feras Eid — 190 Patents

Intel: 190 patents #65 of 30,777Top 1%
Chandler, AZ: #7 of 3,331 inventorsTop 1%
Arizona: #38 of 32,909 inventorsTop 1%
Overall (All Time): #3,789 of 4,157,543Top 1%
190 Patents All Time
Feras Eid has been granted 190 US patents while listed as an inventor at Intel. The first was granted in 2014 and the most recent in December 2025. Feras Eid ranks #3,789 of 4,157,543 US inventors in our database (top 0.09%). Patent records list Feras Eid in Chandler, AZ, US.

Patents per Year

Patents granted per year, 2014 to 2025Bar chart with a peak of 35 patents in 2022.peak 352014: 1 patents20142015: 2 patents2016: 12 patents20162017: 13 patents2018: 14 patents20182019: 21 patents2020: 13 patents20202021: 19 patents2022: 35 patents20222023: 22 patents2024: 24 patents20242025: 14 patents2025

Issued Patents All Time

Showing 126–150 of 190 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10594029 Actuatable and adaptable metamaterials integrated in package Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart +1 more 2020-03-17 $21,927,000
10594294 Piezoelectric package-integrated delay lines Adel A. Elsherbini, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair, Georgios Dogiamis +2 more 2020-03-17 $21,927,000
10508961 Semiconductor package with air pressure sensor Kevin Lin, Qing Ma, Johanna M. Swan, Weng Hong Teh 2019-12-17 $31,829,000
10492267 Display for stretchable computing device Adel A. Elsherbini, Sasha N. Oster, Nadine L. Dabby, Aleksandar Aleksov, Braxton Lathrop 2019-11-26 $25,149,000
10475736 Via architecture for increased density interface Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch +3 more 2019-11-12 $21,873,000
10453635 Package MEMS switch and method Qing Ma, Johanna M. Swan, Valluri Rao 2019-10-22 $16,310,000
10432167 Piezoelectric package-integrated crystal devices Adel A. Elsherbini, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan +2 more 2019-10-01 $22,201,000
10424559 Thermal management of molded packages Nader N. Abazarnia, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster, Tannaz Harirchian +1 more 2019-09-24 $28,939,000
10418605 Embedded formation of wearable and flexible batteries Veronica Strong, Sasha N. Oster, Aranzazu MAESTRE CARO 2019-09-17 $19,673,000
10410939 Package power delivery using plane and shaped vias Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more 2019-09-10 $24,704,000
10386204 Integrated sensor and homologous calibration structure for resonant devices Sasha N. Oster, Thomas L. Sounart, Georgios Dogiamis 2019-08-20 $17,708,000
10381291 Lithographacally defined vias for organic package substrate scaling Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Aleksandar Aleksov, Javier Soto 2019-08-13 $24,877,000
10361142 Dual-sided die packages Henning Braunisch, Adel A. Elsherbini, Johanna M. Swan, Don Nelson 2019-07-23 $32,139,000
10325860 Microelectronic bond pads having integrated spring structures Robert L. Sankman, Sandeep B. Sane 2019-06-18 $21,210,000
10314171 Package assembly with hermetic cavity Aleksandar Aleksov, Johanna M. Swan 2019-06-04 $21,702,000
10305019 Piezoelectric devices fabricated in packaging build-up layers Shawna M. Liff 2019-05-28 $17,387,000
10291283 Tunable radio frequency systems using piezoelectric package-integrated switching devices Telesphor Kamgaing, Adel A. Elsherbini, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan +1 more 2019-05-14 $24,469,000
10282965 Synthetic jet delivering controlled flow to sensor system Jessica Gullbrand, Melissa A. Cowan, Chytra Pawashe 2019-05-07 $24,403,000
10264671 Microelectronic devices designed with modular substrates having integrated fuses 2019-04-16 $24,207,000
10251272 Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates Aleksandar Aleksov, Thomas L. Sounart, Georgios Dogiamis, Johanna M. Swan 2019-04-02 $26,887,000
10215164 Fabric-based piezoelectric energy harvesting Nadine L. Dabby, Adel A. Elsherbini, Braxton Lathrop, Aleksandar Aleksov, Sasha N. Oster 2019-02-26 $20,644,000
10186465 Package-integrated microchannels Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath, Mathew J. Manusharow +2 more 2019-01-22 $27,645,000
10179729 Hermetic encapsulation for microelectromechanical systems (MEMS) devices Sarah Haney, Weng Hong Teh, Sasha N. Oster 2019-01-15 $38,709,000
10156583 Method of making an accelerometer Qing Ma, Valluri Rao, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more 2018-12-18 $25,622,000
10134656 Package integrated synthetic jet device Jessica Gullbrand, Melissa A. Cowan 2018-11-20 $25,900,000