Issued Patents All Time
Showing 176–186 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391427 | Thermal management in packaged VCSELs | Shawna M. Liff, Henning Braunisch | 2016-07-12 |
| 9345184 | Magnetic field shielding for packaging build-up architectures | Sasha N. Oster, Sarah Haney, Weng Hong Teh | 2016-05-17 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Valluri Rao, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more | 2016-03-29 |
| 9275955 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Nitin A. Deshpande, Shawna M. Liff | 2016-03-01 |
| 9275969 | Optical interconnect on bumpless build-up layer package | Johanna M. Swan, Weng Hong Teh | 2016-03-01 |
| 9260294 | Integration of pressure or inertial sensors into integrated circuit fabrication and packaging | Kyu Oh Lee, Sasha N. Oster, Sarah Haney | 2016-02-16 |
| 9250261 | Method, apparatus and system for providing metering of acceleration | Kevin Lin, Qing Ma | 2016-02-02 |
| 9242854 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Sarah Haney, Weng Hong Teh, Sasha N. Oster | 2016-01-26 |
| 9200973 | Semiconductor package with air pressure sensor | Kevin Lin, Qing Ma, Johanna M. Swan, Weng Hong Teh | 2015-12-01 |
| 9147633 | Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber | Zhihua Li, Chau Van Ho | 2015-09-29 |
| 8633551 | Semiconductor package with mechanical fuse | Weng Hong Teh, Kevin Lin, Qing Ma | 2014-01-21 |