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Feras Eid — 190 Patents

Intel: 190 patents #65 of 30,777Top 1%

Chandler, AZ: #7 of 3,331 inventorsTop 1%

Arizona: #38 of 32,909 inventorsTop 1%

Overall (All Time): #3,789 of 4,157,543Top 1%

190 Patents All Time

Feras Eid has been granted 190 US patents while listed as an inventor at Intel. The first was granted in 2014 and the most recent in December 2025. Feras Eid ranks #3,789 of 4,157,543 US inventors in our database (top 0.09%). Patent records list Feras Eid in Chandler, AZ, US.

Patents per Year

Issued Patents All Time

Showing 176–190 of 190 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9505607	Methods of forming sensor integrated packages and structures formed thereby	Kyu Oh Lee, Zheng Zhou, Islam A. Salama, Sasha N. Oster, Lay Wai Kong +1 more	2016-11-29	$9,403,000
9501068	Integration of pressure sensors into integrated circuit fabrication and packaging	Kyu Oh Lee, Sasha N. Oster, Sarah Haney	2016-11-22	$9,157,000
9429427	Inductive inertial sensor architecture and fabrication in packaging build-up layers	Qing Ma, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri Rao	2016-08-30	$15,019,000
9397071	High density interconnection of microelectronic devices	Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more	2016-07-19	$7,217,000
9391427	Thermal management in packaged VCSELs	Shawna M. Liff, Henning Braunisch	2016-07-12	$10,128,000
9345184	Magnetic field shielding for packaging build-up architectures	Sasha N. Oster, Sarah Haney, Weng Hong Teh	2016-05-17	$8,600,000
9297824	Techniques, systems and devices related to acceleration measurement	Qing Ma, Valluri Rao, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more	2016-03-29	$14,056,000
9275969	Optical interconnect on bumpless build-up layer package	Johanna M. Swan, Weng Hong Teh	2016-03-01	$12,287,000
9275955	Integrated circuit package with embedded bridge	Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Nitin A. Deshpande, Shawna M. Liff	2016-03-01	$12,287,000
9260294	Integration of pressure or inertial sensors into integrated circuit fabrication and packaging	Kyu Oh Lee, Sasha N. Oster, Sarah Haney	2016-02-16	$10,295,000
9250261	Method, apparatus and system for providing metering of acceleration	Kevin Lin, Qing Ma	2016-02-02	$9,951,000
9242854	Hermetic encapsulation for microelectromechanical systems (MEMS) devices	Sarah Haney, Weng Hong Teh, Sasha N. Oster	2016-01-26	$9,792,000
9200973	Semiconductor package with air pressure sensor	Kevin Lin, Qing Ma, Johanna M. Swan, Weng Hong Teh	2015-12-01	$16,442,000
9147633	Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber	Zhihua Li, Chau Van Ho	2015-09-29	$22,047,000
8633551	Semiconductor package with mechanical fuse	Weng Hong Teh, Kevin Lin, Qing Ma	2014-01-21	$22,199,000