Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Jianyong Xie, Xiaohong Jiang, Sujit Sharan, Kemal Aygun | 2024-08-06 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Robert L. Sankman, Sri Chaitra Jyotsna Chavali, Lijiang Wang, Cemil Geyik | 2024-01-09 |
| 11705390 | Variable in-plane signal to ground reference configurations | Andrew Collins | 2023-07-18 |
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Kristof Darmawikarta, Henning Braunisch, Prashant Parmar +3 more | 2019-11-12 |