Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Jianyong Xie, Xiaohong Jiang, Sujit Sharan, Kemal Aygun | 2024-08-06 | $17,070,000 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Robert L. Sankman, Sri Chaitra Jyotsna Chavali, Lijiang Wang, Cemil Geyik | 2024-01-09 | $30,329,000 |
| 11705390 | Variable in-plane signal to ground reference configurations | Andrew Collins | 2023-07-18 | $21,060,000 |
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Kristof Darmawikarta, Henning Braunisch, Prashant Parmar +3 more | 2019-11-12 | $21,873,000 |