Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12009320 | Interconnect loss of high density package with magnetic material | Zhiguo Qian, Jiwei Sun, Gang Duan, Kemal Aygun | 2024-06-11 | $21,221,000 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Robert L. Sankman, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang | 2024-01-09 | $30,329,000 |
| 11810859 | Multi-layered adhesion promotion films | Srinivas V. Pietambaram, Rahul N. Manepalli, Kemal Aygun | 2023-11-07 | $22,371,000 |
| 11508676 | Density-graded adhesion layer for conductors | Rahul N. Manepalli, Kemal Aygun, Srinivas V. Pietambaram | 2022-11-22 | $12,862,000 |
| 10840196 | Trace modulations in connectors for integrated-circuit packages | Zhiguo Qian | 2020-11-17 | $36,756,000 |
| 10303225 | Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby | Kemal Aygun, Zhichao Zhang, Guneet Kaur | 2019-05-28 | $17,387,000 |