Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost

Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost

US Patent 12057413 · Granted Aug 6, 2024

Estimated economic value: $17,070,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Centrifugal fan, neck fan, and vortex shell assembly2025
Centrifugal fan, neck fan, and vortex shell assembly2025
Neck fan2025
Data storage device and method for hybrid space balancing based on host read aff2025
Ground via clustering for crosstalk mitigation2025
Image sensor structure and manufacturing method thereof2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Glass substrates having signal shielding for use with semiconductor packages and2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Display screen or portion thereof with graphical user interface2025
Through-substrate optical vias2025