Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch +3 more | 2019-11-12 | $21,873,000 |
| 7321167 | Flex tape architecture for integrated circuit signal ingress/egress | Dong Zhong, Yuan-Liang Li, Jianggi He, Jung Kang, Hyunjun Kim +1 more | 2008-01-22 | $26,995,000 |